Geological Polymer Reflector for Photoelectric Device Packaging
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Solution Overview
Problem
Conventional light emitters face issues due to the limitations of adhesives used in packaging frames, such as aging under high temperatures and unstable bonding interfaces, which affect the performance and reliability of photoelectric devices.
Innovation Solution
The use of a geological polymer as a reflector or connective layer in the packaging frame, which is formed using mineral powders with silicon oxygen tetrahedron and aluminum oxygen tetrahedron structures activated by an alkali solution, providing excellent bonding properties and stability with materials like metal, glass, and ceramic, and can be solidified at room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If organic compound adhesive is used to bond components, then bonding is achieved, but the adhesive ages easily under temperature and highly energetic wavebands
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding material from organic compound to geological polymer (inorganic material). This fundamental material parameter change enables resistance to temperature and waveband conditions that cause organic adhesive degradation, thereby extending service life while maintaining bonding stability.
Solution Approach 2:
The patent replaces the short-lived organic adhesive with a long-lived inorganic geological polymer. The geological polymer's resistance to thermal and radiative degradation allows it to function indefinitely under operating conditions where organic adhesives would fail, effectively eliminating the need for replacement.
2Reliability
If alloy adhesive is used for bonding, then connection is achieved, but huge characteristic differences of bonding interfaces cause connective structure instability
Solution Approach 1:
The patent employs geological polymer as a homogeneous bonding material that creates uniform bonding interfaces across different substrates. The geological polymer's consistent chemical and physical properties ensure uniform adhesion characteristics, eliminating the interface instability caused by alloy adhesive's heterogeneous composition and varying bonding characteristics.
3Reliability
If ceramic substrate is bonded at high process temperature, then bonding is achieved, but organic adhesive cannot withstand the temperature
Solution Approach 1:
The patent changes the thermal stability parameter of the bonding material by transitioning from organic adhesive to geological polymer. The inorganic geological polymer can withstand high process temperatures required for ceramic substrate bonding without degrading, enabling successful bonding where organic adhesives would fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The geological polymer enhances the adhesion and mounting stability of photoelectric devices, offering improved chemical and thermal stability, airtightness, and mechanical strength, leading to more reliable connections and diversified product realization.
Implementation Method 1
the intermediate of the geological polymer can be solidified/hardened at room temperature
Implementation Method 2
adding an alkali activator into the mixed powders to form a slurry with fluidic and thixotropic properties
Data Source
AI summary
A packaging frame for a photoelectric device chip exemplarily includes a lead frame, an insulator and a reflector disposed on the lead frame and the insulator. The lead frame includes a positive electrode pad and a negative electrode pad. The insulator is disposed between the positive electrode pad and the negative electrode pad. The reflector is formed with a through hole to define regions where the lead frame and the insulator are located in the through hole as a die bonding region. The reflector is connected with the lead frame by a geological polymer. The geological polymer is employed as the material of the reflector owing to the excellent interfacial bonding performance with various materials, and a connector or a connective layer formed therefrom has good chemical and thermal stabilities, excellent airtightness, high mechanical strength and weathering resistance, which can significantly enhances adhesion and mounting stability of device.