Germanium Oxide Semiconductor Doping for High Carrier Density
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Solution Overview
Problem
Current methods for creating germanium oxide semiconductors with high carrier density and suitable electrical characteristics are limited, particularly in achieving carrier densities of 1.0×10^18/cm^3 or more, which is essential for advanced semiconductor devices.
Innovation Solution
A method involving the mist CVD technique is used to dope germanium oxide, where a raw material solution with a higher content of germanium than dopant elements is atomized, carried by a carrier gas, and thermally reacted on a base to form an oxide semiconductor with a carrier density of 1.0×10^18/cm^3 or more, utilizing antimony as a dopant to enhance conductivity and reduce resistivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional methods are used to create germanium oxide semiconductor, then the manufacturing process is simpler, but the carrier density remains below 1.0×10^18/cm^3
Solution Approach 1:
The patent changes the chemical composition parameters by incorporating antimony dopant at specific concentrations (0.01-5 atomic%) and controlling oxygen content to achieve carrier density ≥1.0×10^18/cm^3. This compositional parameter change enables high carrier density while maintaining manufacturing feasibility through established CVD processes.
Solution Approach 2:
The patent creates a composite oxide semiconductor material combining germanium oxide with antimony dopant and controlled oxygen content. This composite structure achieves superior electrical characteristics (high carrier density and mobility) that cannot be obtained with pure germanium oxide alone, resolving the contradiction between performance and manufacturing complexity.
2Reliability
If germanium oxide is used as semiconductor material, then wide band gap properties are achieved, but carrier density and electrical conductivity are insufficient
Solution Approach 1:
The patent modifies the electrical parameters of germanium oxide by controlling dopant concentration (antimony at 0.01-5 atomic%) and oxygen content (5-50 atomic%). These parameter changes simultaneously improve carrier density and maintain the wide band gap property, achieving reliable electrical characteristics for power device applications.
Solution Approach 2:
The patent introduces localized dopant regions with antimony atoms substituted at specific lattice positions in the germanium oxide structure. This local quality change creates high carrier density regions while preserving the overall wide band gap material properties, enabling both high reliability and sufficient conductivity.
3Quantity of substance
If higher carrier density is achieved through doping, then electrical conductivity improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes a dopant concentration range (0.01-5 atomic% antimony) that provides sufficient manufacturing tolerance. Within this range, carrier density ≥1.0×10^18/cm^3 is achieved while maintaining reasonable manufacturing precision requirements, allowing standard CVD processes to produce consistent results without excessive control complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in an oxide semiconductor with superior electrical characteristics, including high carrier density and low resistivity, suitable for advanced semiconductor devices such as power conversion and control systems, offering improved breakdown voltage resistance and performance.
Implementation Method 1
atomizing or forming droplets of a raw material solution containing a dopant element and germanium
Implementation Method 2
simultaneously causing the atomized droplets to thermally react on the base
Implementation Method 3
utilizing antimony as a dopant to enhance conductivity and reduce resistivity
Data Source
AI summary
Provided is an oxide semiconductor including an oxide of germanium, the oxide semiconductor having a carrier density of 1.0×1018/cm3 or more. Provided is method of manufacturing an oxide semiconductor including an oxide of germanium doped on a base, the method including: atomizing or forming droplets of a raw material solution containing a dopant element and germanium, a content of the germanium being greater than a content of the dopant element; supplying a carrier gas to the atomized droplets obtained; and carrying the atomized droplets onto the base by the carrier gas, and simultaneously causing the atomized droplets to thermally react on the base.


