Getter-Sealed Bonded Structure for MEMS Gas Barrier Reliability
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Solution Overview
Problem
In semiconductor device fabrication and packaging, existing adhesives used to seal microelectromechanical systems (MEMS) devices are permeable to gases, leading to potential damage from moisture and gases like hydrogen or oxygen, and have long-term reliability issues, necessitating improved sealing solutions.
Innovation Solution
The use of bonded structures with a getter material disposed between elements to absorb and occlude gases, preventing them from reaching interior regions, where the getter material is selected based on the types of gases present and can be directly bonded without an intervening adhesive, creating a hermetical or near-hermetical seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesives are used to seal MEMS devices, then sealing is achieved, but gas permeability occurs over time allowing moisture and gases to damage integrated devices
Solution Approach 1:
A getter material layer is introduced as an intermediary between the adhesive seal and the integrated device. This getter layer actively absorbs and removes gases and moisture that penetrate through the adhesive, preventing them from reaching and damaging the integrated device. The getter material serves as a protective mediator that addresses the gas permeability issue without requiring changes to the adhesive sealing mechanism itself.
Solution Approach 2:
The sealing structure is transformed into a composite system combining adhesive material and getter material layers. The adhesive provides the primary seal, while the getter material layer provides gas absorption functionality. This composite structure leverages the strengths of both materials to achieve both sealing and gas protection functions simultaneously.
2Ease of manufacture
If adhesives are used to bond elements, then bonding is achieved, but long-term reliability issues occur
Solution Approach 1:
The getter material layer is applied beforehand as a cushioning protective layer between the adhesive bond and the integrated device. This layer anticipates and prevents potential gas-related damage before it can occur, providing long-term protection without affecting the ease of the bonding process. The getter material acts as a pre-positioned protective barrier.
3Object-affected harmful factors
If getter material is added to the bonded structure, then gas absorption capability is improved, but device complexity increases
Solution Approach 1:
The getter material is applied as a thin film or coating layer on the bonding surface, rather than as a thick or bulky component. This thin-film approach provides effective gas absorption capability while minimizing the increase in device complexity and maintaining a compact structure. The getter layer integrates seamlessly into the existing bonded structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively seals MEMS devices and cavities from external gases, enhancing the reliability and longevity of integrated devices by using getter materials like aluminum, barium, and titanium to absorb gases, thereby maintaining an ideal environment within the bonded structure.
Implementation Method 1
a getter material that is configured to reduce the diffusion of gas into an interior region of the bonded structure
Implementation Method 2
absorb and occlude gases, preventing them from reaching interior regions
Implementation Method 3
a getter material that is configured to reduce the diffusion of gas into an interior region of the bonded structure
Data Source
AI summary
A bonded structure is disclosed. The bonded structure can include a first element that has a first bonding surface. The bonded structure can further include a second element that has a second bonding surface. The first and second bonding surfaces are bonded to one another along a bonding interface. The bonded structure can also include an integrated device that is coupled to or formed with the first element or the second element. The bonded structure can further include a channel that is disposed along the bonding interface around the integrated device to define an effectively closed profile The bonded structure can also include a getter material that is disposed in the channel. The getter material is configured to reduce the diffusion of gas into an interior region of the bonded structure.