Getter-Integrated Microcomponent Cover for Vacuum Maintenance
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Solution Overview
Problem
Existing encapsulation methods for microcomponents with getters are incompatible with miniaturization, prone to getter saturation, and not suitable for wafer-level packaging, leading to operational issues and particle release.
Innovation Solution
An encapsulated microcomponent with a sealed cavity containing a getter material plug and optional sealing portion, produced using thin film technology, where the getter material is deposited in a column structure to maximize gas absorption and the sealing portion is made of materials like gold or silicon nitride to enhance the seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a discrete getter is placed in the cavity to absorb residual gases, then the vacuum quality is improved, but the device volume increases and miniaturization is hindered
Solution Approach 1:
The getter is integrated directly into the cover structure, merging the vacuum maintenance function with the encapsulation structure. This eliminates the need for separate discrete getter elements and reduces overall device volume while maintaining vacuum quality.
Solution Approach 2:
The cover serves multiple functions: it provides mechanical encapsulation and simultaneously incorporates the getter function for vacuum maintenance. This multi-functionality reduces the number of separate components needed and enables miniaturization.
2Productivity
If the getter is placed in the cavity before microcomponent completion, then gas absorption begins early, but the getter risks premature saturation and particle release
Solution Approach 1:
The getter is prepared and positioned in the cover before encapsulation, but its activation is timed to occur after microcomponent completion. This preliminary positioning with delayed activation prevents premature saturation while maintaining productivity.
Solution Approach 2:
The getter activation is made dynamic and controllable, allowing it to be activated at the optimal moment after microcomponent completion rather than statically being active from the beginning. This dynamic control prevents premature saturation.
3Productivity
If the cover is sealed early to enclose the microcomponent, then encapsulation is completed faster, but the getter cannot be properly activated and may become saturated
Solution Approach 1:
The encapsulation process is segmented into distinct phases: first sealing the microcomponent in the cavity, then separately activating the getter. This segmentation allows both rapid encapsulation and proper getter activation to occur without conflict.
Solution Approach 2:
The cover is prepared with the getter integrated before sealing, but the getter activation is performed as a preliminary action after sealing rather than before. This sequence enables fast encapsulation while ensuring proper getter activation.
4Reliability
If a large cavity is used to accommodate a discrete getter, then the getter can function properly, but the device cannot be miniaturized
Solution Approach 1:
The getter is implemented as a thin film integrated into the cover structure rather than a bulky discrete element. This thin-film approach maintains getter functionality while minimizing the space required in the cavity.
Solution Approach 2:
The getter function is concentrated in a localized region within the cover structure rather than requiring a large distributed volume. This local implementation maintains effectiveness while enabling miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for miniaturized microcomponents with reduced bulk, preventing premature saturation and particle release, enabling efficient gas control and maintaining vacuum integrity throughout the component's lifetime.
Implementation Method 1
The getter takes the form of a discrete element or a thin film and is placed in the cavity defined by the cover. A getter in the form of a discrete element or in the form of a film must be placed near the microcomponent, and will contribute to reducing or stabilising the pressure in the cavity by absorbing residual gases emitted by various parts present in the cavity
Data Source
AI summary
The invention relates to an encapsulated microcomponent having a cover (3) delimiting a sealed cavity (4) equipped with at least one orifice (5) provided with a plug (6). The plug (6) comprises a getter material portion (6.1) exposed inside the cavity (4).Application in particular in MEMS.


