GIS Wafer Mapping for Spatial Defect Correlation Analysis
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Solution Overview
Problem
Current semiconductor wafer manufacturing lacks a method to visualize the correlation between components and effectively analyze test results, hindering defect detection and process optimization.
Innovation Solution
A GIS-based spatial wafer map is created using vector-based spatial data, applying a coordinate system to visualize components like chips, banks, and mats, and analyzing test results through pattern and correlation analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a wafer map is created using traditional methods, then the wafer components can be represented, but the correlation between components cannot be visualized and test results cannot be effectively analyzed
Solution Approach 1:
The patent applies GIS technology to transform the traditional two-dimensional wafer map into a multi-layered spatial information system. By introducing thematic map layers that overlay different wafer components (chips, cells, mats, banks) with their spatial coordinates, the system visualizes correlations between components that were previously invisible in conventional flat wafer maps.
Solution Approach 2:
The wafer map system is designed to perform multiple functions simultaneously: it stores component spatial information, visualizes correlations between components, analyzes test results by location, and supports various queries about wafer structure. This multi-functional approach consolidates what would otherwise require separate systems into a single unified platform.
2Measurement precision
If GIS-based spatial wafer map is implemented, then test results visualization and defect detection are improved, but system complexity increases
Solution Approach 1:
The system segments wafer information into distinct thematic map layers, each representing a specific component type (chips, cells, mats, banks) with its own attributes and spatial coordinates. This segmentation allows precise querying and analysis of specific component types while maintaining the overall wafer context, improving measurement precision without overwhelming the system with monolithic complexity.
Solution Approach 2:
The patent introduces a coordinate system as an intermediary that bridges the physical wafer structure and the digital representation. By converting physical positions into standardized coordinates that can be stored and processed in the GIS system, the patent enables precise spatial queries and analysis while abstracting away the complexity of direct physical measurements.
3Loss of information
If detailed spatial information of all wafer components is stored, then correlation analysis is enabled, but data processing time increases
Solution Approach 1:
The system performs preliminary organization of wafer component data into structured thematic map layers with predefined spatial relationships and attributes. By pre-processing and structuring the data in this way, the system enables rapid querying and analysis of spatial correlations without requiring complex real-time computations, thus reducing processing time for subsequent analyses.
Data Source
AI summary
Disclosed is a method for producing a wafer map. More specifically, the present invention relates to: a method for producing a wafer map used for manufacturing chips in the semiconductor field, wherein a geographic information system (GIS) technique is used to produce the wafer map; and a method and system for providing wafer test results using same. According to an embodiment of the present invention, a semiconductor wafer is formed as a map by using the GIS technique, a coordinate system used in the GIS is utilized to create a map of the same size as an actual semiconductor wafer, and each of various constituent elements constituting the wafer can be stratified to reflect the actual size of the element to create a wafer map in which each of the elements is geocoded.