Glass Adhesive Laser Welding for OLED Packaging
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Solution Overview
Problem
Conventional UV glue packaging methods for OLEDs allow moisture and oxygen penetration, affecting display performance due to the organic nature and molecular structure of the glue, making them unsuitable for applications sensitive to these elements.
Innovation Solution
A glass packing method involving a glass cover and substrate, where ring-shaped glass adhesive is coated and laser-welded to create a sealed space filled with nitrogen, using glass powder and inorganic materials like V2O5, with additional outer and inner frame glues to enhance sealing and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If UV glue is used for encapsulation, then curing speed and production efficiency are improved, but moisture and oxygen penetration occurs affecting OLED performance
Solution Approach 1:
The patent changes the material parameter from organic UV glue to inorganic glass adhesive, fundamentally altering the chemical composition to eliminate the molecular gap issue while maintaining the encapsulation function. This parameter change resolves the contradiction by providing both sealing capability and moisture/oxygen barrier properties.
Solution Approach 2:
The patent uses composite glass adhesive materials containing glass powder, inorganic packing materials (V2O5), and organic solvents. This composite structure combines the benefits of glass (sealing and barrier properties) with the processability of organic solvents, achieving both high productivity through laser curing and reliable protection against moisture and oxygen.
2Reliability
If glass adhesive with solvent is used, then protection against moisture and oxygen is improved, but production efficiency decreases due to heating process requirements
Solution Approach 1:
The patent replaces the conventional thermal heating process with laser radiation for curing the glass adhesive. This substitution uses optical energy (laser) instead of thermal fields, enabling rapid localized curing without requiring extensive heating equipment, thereby improving production efficiency while maintaining the moisture and oxygen protection benefits of glass adhesive.
Solution Approach 2:
The patent utilizes the phase transition of the organic solvent in glass adhesive from liquid to evaporated state through laser heating. The laser energy causes the solvent to rapidly evaporate, leaving behind the cured glass adhesive matrix that provides sealing and barrier functions. This phase transition mechanism enables efficient solvent removal and adhesive curing in a single step.
3Productivity
If laser radiation is applied to cure glass adhesive, then production efficiency is improved, but precise control of radiation parameters is required
Solution Approach 1:
The patent employs V2O5 (vanadium pentoxide) as an inorganic packing material that absorbs laser energy and converts it to heat, which then cures the organic solvent in the glass adhesive. This self-heating mechanism allows the material itself to facilitate the curing process, reducing the need for precise external radiation parameter control while maintaining high production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents moisture and oxygen penetration, extending the life cycle of OLED components and enhancing the mechanical strength of the packaging assembly by forming a sealed, nitrogen-filled space.
Implementation Method 1
radiating the glass adhesive by laser to weld the glass substrate on the glass cover by the glass adhesive
Implementation Method 2
By adopting the laser to melt the glass power such that two glasses are bonded together
Implementation Method 3
radiating the outer frame glue via ultraviolet rays to cure the outer frame glue
Implementation Method 4
The solvent is then removed by a heating process so as to be bonded with the glass substrate
Data Source
AI summary
The present disclosure relates to a packaging assembly and a glass packing method. The method includes the following steps: coating ring-shaped glass adhesive on the glass cover; coating outer frame glue of ring-shaped at an outer side of the glass adhesive, wherein the outer frame glue is spaced apart from the glass adhesive; coating inner frame glue at an inner side of the glass adhesive; filling packing material to an inner side of the inner frame glue; bonding the glass substrate on the glass cover; and radiating the glass adhesive by laser to weld the glass substrate on the glass cover by the glass adhesive. The method prevents the oxygen and the moisture from entering the glass adhesive so as to extend the life cycle of the components within the glass adhesive.