Glass Bridge Substrate Structure for Package Warpage Control
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Solution Overview
Problem
The challenge is to address the warping issue in electronic packages as they increase in size due to the integration of multiple IC dies, which affects the area form factor and reliability, leading to susceptibility to warpage, solder joint geometries, and reduced assembly yield.
Innovation Solution
Incorporating a stiffening layer made of ceramic or glass within the substrate, which can be a multi-layer stack including at least one glass and one ceramic layer, to reduce warpage and improve the robustness of the electronic package, along with redistribution layers and conductive traces for interconnectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple IC dies are integrated into a single package, then functional complexity and system efficiency are improved, but the area form factor increases and the package becomes susceptible to warping
Solution Approach 1:
The patent employs a composite substrate structure combining organic material layers with ceramic stiffening layers. The organic material provides flexibility and electrical interconnect capabilities, while the ceramic layers provide high stiffness and dimensional stability. This composite approach allows the package to accommodate multiple IC dies with high functional complexity while the ceramic stiffening layers prevent warping by maintaining structural rigidity across the expanded area form factor.
2Adaptability or versatility
If the area form factor of the package is increased to accommodate more IC dies, then system integration is improved, but the package becomes more susceptible to warpage and reduced assembly yield
Solution Approach 1:
The substrate is segmented into multiple functional layers including organic material layers for electrical interconnect and ceramic layers for mechanical stiffening. This segmentation allows each layer to perform its specialized function: the organic layers provide flexible routing for high system integration, while the discrete ceramic stiffening layers are strategically positioned to counteract warpage tendencies and maintain assembly yield reliability across the expanded package area.
3Stability of the object's composition
If a stiffening layer is added to reduce warpage, then structural stability is improved, but the device complexity increases
Solution Approach 1:
The ceramic stiffening layers serve multiple functions simultaneously: they provide mechanical stiffness to prevent warpage, act as structural support for the organic interconnect layers, and can be integrated into the manufacturing process flow. This multi-functionality reduces the need for additional dedicated stiffening components, thereby limiting the increase in device complexity while achieving the desired structural stability.
Data Source
AI summary
An electronic device comprises a substrate including an organic material; a glass bridge die included in the substrate, the glass bridge die including electrically conductive interconnect; and a first integrated circuit (IC) die and at least a second IC die arranged on a surface of the substrate and including bonding pads connected to the interconnect of the glass bridge die.