Glass Substrate Carrier with Conical Recesses for Low-Absorption Support

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Solution Overview

Problem

Existing glass substrate processing techniques face challenges in creating precise, durable, and efficient structures for handling substrates during laser-induced deep etching, particularly in maintaining minimal contact area and preventing radiation absorption and ablation.

Innovation Solution

A glass substrate carrier with a structured surface featuring conical recesses and through-holes, manufactured using laser-induced deep etching and wet-chemical treatment, which allows for minimal contact and effective distribution of negative pressure, while preventing radiation absorption through micro-structured surfaces and conductive coatings.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a flat glass substrate carrier is used for substrate processing, then the substrate can be supported, but the contact area is large causing radiation absorption and ablation

Engineering Contradiction:

Improveradiation absorptionVSAvoidcontact area

Core Design Contradiction:

Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The flat substrate support surface is segmented into multiple conical recesses and through-holes, reducing the continuous contact area to discrete points while maintaining substrate fixation capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The substrate carrier is transformed into a porous structure with multiple recesses and through-holes, allowing electromagnetic radiation to pass through rather than being absorbed by a continuous surface

Inventive Principle:

Principle #31Porous materials

2Reliability

If deep structures are created in glass substrate carrier, then substrate fixation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvesubstrate fixationVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Traditional mechanical drilling or cutting methods are replaced by laser-induced deep etching, using optical energy to create precise conical structures without mechanical contact

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The manufacturing process utilizes controllable laser parameters (pulse duration, energy density, focal depth) to precisely control the depth and shape of conical recesses, enabling reliable substrate fixation through parameter optimization rather than complex mechanical processes

Inventive Principle:

Principle #35Parameter changes

3Object-affected harmful factors

If through-holes are created in the substrate carrier, then radiation transmission is improved, but structural strength decreases

Engineering Contradiction:

Improveradiation transmissionVSAvoidstructural strength

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The through-holes are formed with conical geometry rather than cylindrical shapes, distributing stress more effectively around the openings while maintaining radiation transmission capability

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The substrate carrier exhibits local quality variations with dense, strong regions between conical recesses and through-holes, while the recessed areas provide radiation transmission pathways, creating an optimized balance between strength and transparency

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables precise positioning and fixation of substrates with minimal contact area, enhanced durability against radiation, and reduced absorption, ensuring efficient processing of thin substrates with uniform pressure distribution and static charge dissipation.

Implementation Method 1

LIDE (Laser Induced Deep Etching) for the creation of deep structures

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

a process for precision machining of glass using laser-induced deep etching has become known as LIDE

Methodology Applied

Scientific EffectLaser-induced deep etching:

Implementation Method 3

the modified regions of the glass substrate due to the action of an etching medium by successive etching

Methodology Applied

Scientific EffectAnisotropic etching:

Implementation Method 4

a transparent material, for example a glass plate, is modified by means of a laser pulse or a pulse train over an elongated region along the beam axis, often over the entire thickness of the transparent material, and is then anisotropically etched in a wet-chemical etching bath

Methodology Applied

Scientific EffectWet-chemical etching:

Implementation Method 5

conductive coatings

Methodology Applied

Scientific EffectConduction: Conduction (electrical)

Data Source

PatentUS20230405726A1Substrate carrier made of glass for processing a substrate and a method for manufacture of the substrate carrier

Publication Date: 2023.12.21 LPKF LASER & ELECTRONICS AG

AI summary

A substrate carrier made of glass for processing a transparent or transmissive substrate by electromagnetic radiation includes a first upper side serving as a substrate support and a lower side facing away from the upper side. The substrate support and/or the lower side of the substrate carrier has a structuring produced by modifications in the substrate carrier and a material removal by action of an etching medium in respective regions of the modifications in the substrate carrier. The structuring has a plurality of adjacent and/or merging conical recesses. At least one of the conical recesses is configured as a through-hole of the substrate carrier between the substrate support and the lower side, and a plurality of other ones of the conical recesses are configured as depressions.