Glass-Carrier Electronic Assembly for Heat-Resistant Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of electronic devices faces challenges in combining substrates of different materials, particularly in achieving a balance between heat resistance and cost effectiveness.
Innovation Solution
An electronic device design that combines a carrier with a substrate, featuring a first bonding pad, conductive layers, and insulating layers with vias, where the substrate has through holes aligned with the bonding pad and connecting elements, allowing for electrical connection and minimizing the distance between them, thereby integrating a heat-resistant glass substrate with a cost-effective carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a glass substrate with better heat resistance is combined with a carrier of lower cost, then heat resistance is improved and cost is reduced, but the manufacturing complexity increases due to combining different materials
Solution Approach 1:
The device is divided into two distinct parts: a glass substrate for high-temperature processing and heat resistance, and a separate carrier for cost-effectiveness and structural support. This segmentation allows each material to be optimized for its specific function while avoiding the need to manufacture the entire device from expensive heat-resistant materials.
Solution Approach 2:
The patent employs a composite structure combining glass substrate and carrier materials. The glass substrate provides thermal stability for high-temperature processes, while the carrier offers mechanical support and cost benefits. This composite approach resolves the contradiction by integrating materials with complementary properties rather than using a single material for all requirements.
2Adaptability or versatility
If substrates of different materials are combined in the manufacturing process, then material advantages are achieved, but the difficulty of combining different materials increases
Solution Approach 1:
The glass substrate is prepared in advance with through-holes and bonding pads positioned at specific locations before being combined with the carrier. This preliminary preparation of the substrate allows for precise alignment and simplifies the subsequent combination process with the carrier, reducing the overall manufacturing difficulty despite using different materials.
Solution Approach 2:
The patent introduces intermediate elements such as bonding pads, conductive layers, and insulating layers that facilitate the connection between the glass substrate and the carrier. These intermediary components act as mediators that enable reliable electrical and mechanical connections between dissimilar materials, making the combination process more manageable.
3Reliability
If through holes are aligned with bonding pads and connecting elements, then electrical connection is improved, but the precision requirement increases
Solution Approach 1:
The through-holes, bonding pads, and connecting elements are pre-positioned and pre-aligned on the glass substrate and carrier respectively before final assembly. This preliminary alignment ensures that when the components are combined, the electrical connections are properly established without requiring extremely high precision during the final assembly step.
Solution Approach 2:
The patent applies different quality requirements to different regions: the through-holes and bonding pads in critical connection areas are manufactured with higher precision, while other areas of the substrate can have relaxed tolerances. This localized approach to precision focuses manufacturing effort where it is most needed for electrical connection reliability.
Data Source
AI summary
An electronic device includes a carrier, a first electronic element, and a first connecting element. The carrier has a first bonding pad, a first conductive layer, a second conductive layer and an insulating layer with a via. The first conductive layer is disposed between the first bonding pad and the insulating layer, and electrically connected to the second conductive layer through the via. The first electronic element is disposed on the carrier and has a substrate. The first connecting element is disposed between the top surface of the first bonding pad and the first electronic element and electrically connected to the first bonding pad and the first electronic element. The substrate has a through hole which is overlapped with the first bonding pad and the first connecting element. A minimum distance between the through hole and the via is greater than zero.