Glass Carrier Semiconductor Package for AiP Miniaturization

Solution Overview

Problem

The existing Antenna-in-Package (AiP) systems using organic substrates face challenges in achieving fine-pitch designs and miniaturization due to thickness constraints and CTE mismatch issues, which hinder the reduction of wireless communication device size and increase manufacturing costs.

Innovation Solution

A semiconductor device package is developed using a glass carrier with a conductive layer and a building-up circuit structure, where the glass carrier's thickness is controlled to facilitate miniaturization, and the CTE mismatch is mitigated by recessing the lateral surface of the carrier, allowing for a lower CTE material selection and improved antenna performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If an organic substrate is used in AiP system, then the antenna and communication module can be integrated, but the thickness is relatively thick and fine-pitch design is difficult

Engineering Contradiction:

Improvepackage sizeVSAvoidfine-pitch capability

Core Design Contradiction:

Area of moving objectVSManufacturing precision

Solution Approach 1:

The patent changes the substrate material from organic to glass, fundamentally altering the physical parameters including thickness (reducing to 50-200 μm) and thermal expansion properties. This parameter change enables both miniaturization and fine-pitch design capabilities that were not achievable with organic substrates.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure combining glass substrate with metal layers (aluminum or copper) for antenna elements and circuit traces. This composite approach leverages the dimensional stability and thinness of glass while utilizing the electrical conductivity of metals, achieving both size reduction and manufacturing precision.

Inventive Principle:

Principle #40Composite materials

2Area of moving object

If an organic substrate is used in AiP system, then the antenna and communication module can be integrated, but the CTE mismatch hinders miniaturization

Engineering Contradiction:

Improvepackage sizeVSAvoidCTE mismatch

Core Design Contradiction:

Area of moving objectVSStability of the object's composition

Solution Approach 1:

The patent changes the substrate material from organic to glass, fundamentally altering the physical parameters including thickness (reducing to 50-200 μm) and thermal expansion properties. This parameter change enables both miniaturization and fine-pitch design capabilities that were not achievable with organic substrates.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure combining glass substrate with metal layers (aluminum or copper) for antenna elements and circuit traces. This composite approach leverages the dimensional stability and thinness of glass while utilizing the electrical conductivity of metals, achieving both size reduction and manufacturing precision.

Inventive Principle:

Principle #40Composite materials

3Reliability

If separate manufacturing is used for antenna and communication module, then each component can be optimized independently, but manufacturing costs increase

Engineering Contradiction:

Improvecomponent optimizationVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the antenna and communication module into a single integrated package structure where both components are fabricated on the same glass substrate using compatible manufacturing processes. This consolidation eliminates separate manufacturing steps and assembly operations, reducing overall manufacturing cost while maintaining component optimization through independent circuit design.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The glass substrate serves multiple functions simultaneously: as the mechanical support structure, as the base for antenna elements, and as the platform for communication module circuitry. This multi-functionality approach consolidates what would otherwise require separate components and assembly steps, reducing manufacturing complexity and cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11581273B2Semiconductor device package and method of manufacturing the same

Publication Date: 2023.02.14 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a first circuit layer and an emitting device. The first circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device is disposed on the second surface of the first circuit layer. The emitting device has a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device has a conductive pattern disposed on the second surface of the emitting device. The lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.