Low-Compaction Glass Carrier Substrate for Pattern Stability
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Solution Overview
Problem
The reuse of carrier substrates in electronic device manufacturing under high temperature conditions leads to pattern shifting and reduced manufacturing yield due to heat shrinkage, particularly when the carrier substrate is reused multiple times.
Innovation Solution
A carrier substrate comprising a glass substrate with a compaction of 80 ppm or less, preferably 70 ppm or less, and a strain point of 700° C. or more, along with an adhesive layer, is used to minimize heat shrinkage and ensure high manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a carrier substrate is reused multiple times under high temperature conditions, then productivity is improved through reuse, but manufacturing precision deteriorates due to pattern shifting from heat shrinkage
Solution Approach 1:
The patent applies parameter changes by selecting glass substrates with specific physical properties (compaction ≤80 ppm, strain point ≥700°C) to maintain dimensional stability under repeated high temperature processing. This changes the material parameters to resolve the contradiction between reuse and precision
Solution Approach 2:
The patent directly addresses thermal expansion effects by using glass substrates with low compaction values that minimize heat-induced shrinkage. The low thermal shrinkage characteristic allows the carrier substrate to maintain its dimensions during high temperature processing cycles, preventing pattern shifting
2Manufacturing precision
If the compaction of the glass substrate is reduced to minimize heat shrinkage, then manufacturing precision is improved, but device complexity increases due to stricter material specifications
Solution Approach 1:
The patent establishes specific parameter ranges (compaction ≤80 ppm, strain point ≥700°C) that balance manufacturing precision requirements with material availability. These defined parameters provide clear selection criteria without excessive complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed carrier substrate design maintains excellent manufacturing yield even after multiple reuse cycles by controlling heat-induced shrinkage, thereby reducing pattern deviation and improving the overall production efficiency.
Implementation Method 1
a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes
Data Source
AI summary
A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.