Glass Substrate Carrier Microstructure for Vacuum Laser Processing
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Solution Overview
Problem
Existing glass substrate processing technologies face challenges in creating a densely structured surface with partial permeability to negative pressure, which is essential for precise and radiation-resistant substrate handling during laser processing.
Innovation Solution
A glass substrate carrier with a microstructured surface featuring conical recesses and through openings is produced using laser-induced deep etching, allowing for efficient distribution of negative pressure and enhanced resistance to electromagnetic radiation, while minimizing contact areas and preventing ablation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate carrier is used for laser processing, then substrate handling is enabled, but electromagnetic radiation can be absorbed by the carrier causing unwanted heating or damage
Solution Approach 1:
The glass substrate carrier is provided with a microstructured surface comprising a plurality of recesses, which create a porous-like structure. This structure reduces the contact area between the carrier and substrate while allowing electromagnetic radiation to pass through with minimal absorption, thereby preventing unwanted heating or damage to the carrier.
2Object-affected harmful factors
If the substrate carrier has a microstructured surface with recesses, then radiation resistance is improved, but the manufacturing precision required to create uniform conical recesses increases
Solution Approach 1:
The manufacturing method introduces modifications into the glass substrate carrier material before the actual etching process. These preliminary modifications create a pattern that guides subsequent anisotropic etching, ensuring uniform conical recesses are formed with precise dimensions and spacing, thereby achieving the required manufacturing precision.
Solution Approach 2:
The patent replaces traditional mechanical machining methods with a combination of laser-induced modifications and chemical etching. This substitution allows for more precise control over the recess geometry and uniformity, as the chemical etching process can achieve consistent conical shapes that are difficult to obtain through mechanical means.
3Productivity
If conventional laser processing is used on transparent substrates, then processing speed is maintained, but the substrate must be in direct contact with the carrier causing heat transfer and potential damage
Solution Approach 1:
The microstructured surface with recesses creates a porous-like structure that minimizes contact area between the carrier and substrate. This allows laser processing to proceed at high speed while preventing heat transfer from the carrier to the substrate, eliminating the risk of thermal damage while maintaining productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate carrier achieves minimal contact with the substrate, ensuring even pressure distribution, increased resistance to radiation, and reduced absorption of electromagnetic radiation, enabling precise processing of thin substrates with reduced risk of undesirable effects.
Implementation Method 1
A process for the precision machining of glass using laser-induced deep etching has become known as LIDE (Laser Induced Deep Etching) for the creation of deep structures such as through holes or micro-cuts
Implementation Method 2
a modification designated as Type I is created, which has a significantly weaker form and can typically be produced with about half the power required for TGVs. Subsequently, large panels measuring 300 x 300 mm2 (preferably made of 500 μm material) are treated with a specific pattern
Data Source
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AI summary
The invention relates to a glass substrate carrier (1) for processing a substrate (2) with a first upper surface serving as a substrate support (4) and a lower surface facing away from it, wherein the substrate support (4) has a structured surface. In a first step, modifications are made to create through-holes (8), and in a second step, modifications are made for depressions (9) that have a significantly shallower form. After the modification, the thickness of the plate-shaped material of the substrate carrier (1) is reduced by wet-chemical treatment, thereby widening all conical depressions (9) so that the conical shapes merge into one another. The combination of through-holes (8) and a plurality of conical depressions (9) enables a large-area distribution of the negative pressure applied to a suction opening (12) onto the substrate (2).