High-k Glass Carrier Waveguide Packaging With Relaxed Alignment
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Solution Overview
Problem
Conventional semiconductor manufacturing processes struggle to create precise circuit waveguide interfaces for high-frequency applications, such as millimeter wave systems, leading to increased cost and complexity.
Innovation Solution
A method and apparatus for fabricating circuit waveguide interfaces during wafer-scale die packaging using high dielectric constant glass carriers with ceramic build processes, forming air cavities and patterned ceramic structures to reduce insertion loss and enhance precision, while using conductive via walls and ring structures for waveguide matching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional semiconductor manufacturing processes are used to create circuit waveguide interfaces, then manufacturing simplicity is maintained, but manufacturing precision deteriorates leading to increased cost and complexity
Solution Approach 1:
The patent merges the waveguide interface fabrication process with the standard semiconductor packaging process. The circuit waveguide interface is formed integrally with the package substrate using the same wafer-level processing equipment and techniques already established for packaging, eliminating the need for separate precision machining or assembly steps while achieving the required manufacturing precision
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, electrical connections through conductors, and the circuit waveguide interface for high-frequency signals. This multi-functionality is achieved by forming all these features during a single wafer-level packaging process, reducing overall device complexity while maintaining high precision
2Loss of energy
If conventional packaging processes are used, then process simplicity is maintained, but transition loss increases to unacceptable levels for 5G and 6G applications
Solution Approach 1:
The patent applies local quality by creating a specialized ceramic build process that forms high dielectric constant regions (k=5.8-6.8) in specific areas of the package substrate where waveguide performance is critical. This localized high-k ceramic structure reduces transition loss for millimeter wave signals while the rest of the package can use conventional materials and processes
Solution Approach 2:
The patent uses composite materials by combining glass carrier substrates with patterned ceramic regions of high dielectric constant. This composite structure (glass-ceramic composite) provides both the mechanical properties needed for packaging and the electromagnetic properties needed for low-loss waveguide performance at 5G and 6G frequencies
3Manufacturing precision
If conventional waveguide interfaces are implemented, then design simplicity is maintained, but alignment tolerance requirements become excessively strict
Solution Approach 1:
The patent creates an equipotential waveguide interface by forming conductive via walls and ring structures that provide consistent electrical potential and electromagnetic shielding around the waveguide region. This equipotential structure reduces sensitivity to alignment variations by distributing electric fields uniformly, thereby relaxing alignment tolerance requirements while maintaining signal integrity
4Adaptability or versatility
If high-frequency waveguide capability is added to packaged devices, then functional capability is improved, but manufacturing cost and complexity increase significantly
Solution Approach 1:
The patent performs preliminary action by forming the waveguide interface structure, conductive patterns, and ceramic regions during the wafer-level packaging process before the devices are singulated. This preliminary formation of high-frequency structures during standard packaging operations enables 5G and 6G capability without requiring additional complex manufacturing steps after packaging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces transition loss to 1.0 dB and relaxes alignment tolerance requirements, enabling high-precision and low-cost formation of circuit waveguide interfaces with improved high-frequency performance.
Implementation Method 1
A first high-k dielectric glass carrier substrate is provided. The glass carrier substrate may be formed with a material having a dielectric constant k of at least approximately k=5.8
Implementation Method 2
An air cavity may be formed in the first ceramic region that is positioned in the defined waveguide area
Data Source
AI summary
A wafer-scale die packaging device is fabricated by providing a high-k glass carrier substrate having a ceramic region which includes a defined waveguide area and extends to a defined die attach area, and then forming, on a first glass carrier substrate surface, a differential waveguide launcher having a pair of signal lines connected to a radiating element that is positioned adjacent to an air cavity and surrounded by a patterned array of conductors disposed over the ceramic region in a waveguide conductor ring. After attaching a die to the glass carrier substrate to make electrical connection to the differential waveguide launcher, a molding compound is formed to cover the die, differential waveguide launcher, and air cavity, and an array of conductors is formed in the molding compound to define a first waveguide interface perimeter surrounding a first waveguide interface interior.