Glass Packaging Substrate Cavity Corners to Prevent Shorts and Breakage
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Solution Overview
Problem
Existing semiconductor packaging technologies are limited by high resistivity and high dielectric constant of ceramic substrates, and limitations in reducing wiring pitch of resin substrates, which affect the electrical performance of high-performance, high-frequency semiconductor devices.
Innovation Solution
A packaging substrate using a glass substrate with cavity expansion portions at corners to ensure sufficient distance between cavity elements and edges, featuring through glass vias for shorter electrical paths and improved signal transfer, and a method of manufacturing this substrate by etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrates are used for packaging, then high resistivity and high dielectric constant are achieved, but it becomes difficult to mount high-performance, high-frequency semiconductor devices
Solution Approach 1:
The patent changes the substrate material parameter from ceramic to glass, which has different electrical characteristics (lower dielectric constant and resistivity) that are more suitable for high-frequency semiconductor devices while maintaining packaging reliability
Solution Approach 2:
The patent uses a composite structure combining glass substrate with copper wiring layers and dielectric materials, creating a multi-material system that optimizes both electrical performance and mounting capability for high-frequency devices
2Adaptability or versatility
If resin substrates are used for packaging, then high-performance, high-frequency semiconductor devices can be mounted, but there are limitations in reducing the pitch of the wiring
Solution Approach 1:
The patent changes the substrate material from resin to glass, enabling finer wiring pitch reduction while maintaining the capability to mount high-frequency semiconductor devices, as glass provides better dimensional stability and surface flatness for precise wiring
3Reliability
If through-holes are formed in silicon or glass substrate and conductive materials are applied, then wiring between device and motherboard is shortened and good electrical characteristics are achieved, but the process complexity increases
Solution Approach 1:
The patent forms through-holes in the glass substrate before applying conductive materials and building wiring layers, preparing the substrate in advance to enable shorter electrical paths and better electrical characteristics while systematically managing the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a packaging substrate with enhanced electrical performance, faster signal transfer, and reduced loss characteristics by utilizing a glass substrate with cavity extensions to prevent short-circuiting and substrate breakage, while allowing for more efficient space utilization.
Implementation Method 1
a method of manufacturing the substrate... by etching processes
Data Source
Figure 1
Figure 2A~2B
Figure 3A(a)~3A(b)
AI summary
The present disclosure relates to a substrate, a packaging substrate, and a method for manufacturing the substrate. A substrate according to the present disclosure is a plate-shaped substrate included in a packaging substrate, including a glass substrate having a first face and a second face facing each other, the glass substrate having a cavity portion; and a cavity extension portion; disposed thereon, the cavity portion having an accommodation space therein and having at least one corner, the corner being a virtual line where extensions of two adjacent sides of the accommodation space meet, the cavity extension portion being disposed at the corner and having a corner space connected with the accommodation space. In this way, a sufficient distance between the cavity extension and the edge of the cavity element can be secured to prevent shorting, and the effect of spreading the stress applied to the glass substrate by the cavity extension can occur to prevent the glass substrate from breaking.