Glass Packaging Substrate Cavity Corners for Fine-Pitch Mounting
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Solution Overview
Problem
Existing semiconductor packaging technologies are limited by high resistivity and high dielectric constant of ceramic substrates, and limitations in reducing wiring pitch of resin substrates, which affect the electrical performance of high-performance, high-frequency semiconductor devices.
Innovation Solution
A packaging substrate using a glass substrate with cavity expansion portions that allow for a sufficient distance between the corner of the cavity and the edge of the cavity element, featuring a glass substrate with first and second faces, a cavity portion, and a cavity expansion portion at the corner, with angles and arcs to accommodate electronic elements and improve electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic substrates are used for packaging, then high resistivity and high dielectric constant are achieved, but it becomes difficult to mount high-performance, high-frequency semiconductor devices
Solution Approach 1:
The patent changes the material parameter from ceramic to glass substrate, which has different electrical properties (lower dielectric constant and resistivity) that are more suitable for high-frequency semiconductor devices while maintaining packaging reliability
Solution Approach 2:
The patent uses a composite structure combining glass substrate with copper wiring layers and insulating layers, creating a multi-material system that optimizes both electrical performance and mounting capability for high-frequency devices
2Adaptability or versatility
If resin substrates are used for packaging, then high-performance, high-frequency semiconductor devices can be mounted, but there are limitations in reducing the pitch of the wiring
Solution Approach 1:
The patent changes the substrate material from resin to glass, enabling finer wiring pitch reduction while maintaining the ability to mount high-frequency semiconductor devices, as glass provides better dimensional stability and surface flatness for precise wiring
3Reliability
If through-holes are formed in silicon or glass substrate and conductive materials are applied, then wiring between device and motherboard is shortened with good electrical characteristics, but the corner region of cavity requires sufficient distance from cavity element
Solution Approach 1:
The patent extends the cavity in the thickness direction (Z-axis) at the corner regions, creating a multi-dimensional cavity structure that provides sufficient distance from cavity elements while maintaining good electrical characteristics through the through-holes
Data Source
AI summary
A substrate and a packaging substrate are provided. A substrate according to the present disclosure is a plate-shaped substrate included in a packaging substrate, including a glass substrate having a first face and a second face facing each other, the glass substrate having a cavity portion; and a cavity extension portion; disposed thereon, the cavity portion having an accommodation space therein and having at least one corner, the corner being a virtual line where extensions of two adjacent sides of the accommodation space meet, the cavity extension portion being disposed at the corner and having a corner space connected with the accommodation space.