Glass Packaging Substrate Cavities for Heat Dissipation and Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packaging technologies do not adequately support the electrical performance of high-performance and high-frequency semiconductor elements due to limitations in heat dissipation and mechanical stability, particularly with ceramic and resin substrates, and glass substrates face bending and defect issues during miniaturization.
Innovation Solution
A packaging substrate with a glass substrate featuring a cavity frame and frame through holes, along with a core via and distribution layers, enhances heat dissipation and mechanical properties, allowing for improved electrical connectivity and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a glass substrate is used for high-end packaging, then electrical characteristics are improved, but bending and defects occur during miniaturization
Solution Approach 1:
The glass substrate is divided into multiple regions by cavity frames that create separate cavities. This segmentation allows the substrate to be manufactured in smaller, more manageable sections that are less prone to bending and defects during miniaturization, while still providing the desired electrical characteristics through the through-vias connecting these segmented regions.
Solution Approach 2:
The cavity frames create localized regions with different structural properties. The frames themselves provide mechanical support and stress distribution in critical areas, while the cavities provide thermal management and electrical connection pathways. This local differentiation allows the substrate to maintain electrical performance while reducing manufacturing defects.
2Strength
If ceramic substrate is used, then mechanical strength is improved, but heat dissipation and electrical performance deteriorate
Solution Approach 1:
The packaging substrate uses a composite structure combining glass substrate with cavity frames and through-vias. The glass substrate provides a balance of mechanical strength and thermal properties, while the cavity frames and through-vias (which may be filled with conductive materials) enhance heat dissipation pathways and electrical connectivity, overcoming the limitations of pure ceramic substrates.
Solution Approach 2:
The cavity structure creates a porous or hollow configuration within the substrate. These cavities can be filled with heat dissipation materials or used as thermal channels, significantly improving heat dissipation capability while maintaining the mechanical integrity of the overall substrate structure.
3Temperature
If resin substrate is used, then heat dissipation is improved, but pitch reduction of conductive lines is limited
Solution Approach 1:
The invention moves electrical connectivity from a two-dimensional surface trace approach to a three-dimensional approach using through-vias that penetrate the substrate. This dimensional transition allows conductive paths to be formed vertically through the substrate rather than only horizontally on the surface, enabling much finer pitch reduction that is not limited by resin substrate manufacturing constraints.
4Reliability
If through-via is formed on silicon or glass substrate, then electrical characteristics are improved, but manufacturing complexity increases
Solution Approach 1:
The cavity frames are formed first, creating predefined locations and structures for the through-vias. This preliminary action establishes the framework before the through-via formation process, making the subsequent via creation more straightforward and less complex than forming through-vias in a solid, unstructured substrate.
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
Disclosed are a packaging substrate comprising a glass substrate comprising a first surface and a second surface which is the opposite surface of the first surface; a cavity unit forming a space inside the glass substrate; a cavity frame dividing the space into plural districts; and a cavity element comprised in at least some of the cavity unit, wherein the cavity frame comprises plural frame through holes penetrating in a direction from the one side to the other side.