Glass Ceramic to Metal Foil Laser Bonding With Pulsed Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional laser bonding processes for glass ceramic and metal foil packages often result in insufficient bond strength, primarily due to the non-uniform surface of glass ceramics and the high melting temperature of glass ceramics, which prevents effective melting and bonding.
Innovation Solution
A method of laser bonding that uses a pulsed laser with a wavelength between 250 nm and 2 μm to bond glass ceramic substrates with thicknesses between 20 μm and 250 μm to metal foils, ensuring sufficient transmission and bond strength by adjusting the substrate thickness and using compatible materials like alumina or zirconia ceramics with aluminum foils, achieving bond strengths greater than 3 MPa.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional laser bonding processes are used on glass ceramic, then the process can be performed, but the bond strength is insufficient
Solution Approach 1:
The patent changes the laser wavelength parameter to 250 nm - 2 μm range and controls glass ceramic thickness to 20 μm - 250 μm to achieve sufficient laser transmission through the substrate, enabling effective bonding that was not achieved with conventional laser parameters
Solution Approach 2:
The patent employs pulsed laser irradiation instead of continuous laser beam, using periodic pulses to deliver controlled energy to the glass ceramic-metal interface, achieving reliable bonding while preventing excessive heat accumulation that would occur with continuous irradiation
2Strength
If glass ceramic thickness is increased to improve structural integrity, then strength is improved, but laser transmission decreases making bonding difficult
Solution Approach 1:
The patent establishes an optimal parameter range where glass ceramic thickness is maintained between 20 μm - 250 μm, which is thick enough for structural integrity but thin enough to allow sufficient laser transmission for effective bonding
Solution Approach 2:
The patent uses pulsed laser irradiation with energy density of 1 J/cm² - 6 J/cm², delivering sufficient energy to achieve bonding through the glass ceramic without excessive energy that would cause damage or melting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces glass ceramic and metal foil packages with sufficient bond strength and flexibility, allowing for bending without breaking, and can form packages like parabolic reflector antennas with enhanced radiation properties.
Implementation Method 1
directing a laser beam on at least a portion of the first contact location to bond the first glass ceramic substrate to the first metal foil
Implementation Method 2
the first glass ceramic substrate has a transmission greater than or equal to 50% at a wavelength greater than or equal to 250 nm and less than or equal to 2 μm
Implementation Method 3
conducting a first welding step by directing a laser beam on at least a portion of the first contact location to bond the first glass ceramic substrate to the first metal foil
Implementation Method 4
the high melting temperature of glass ceramics, which prevents effective melting and bonding
Data Source
AI summary
A method of laser bonding glass ceramic to metal foil includes contacting a first surface of a first glass ceramic substrate with a first surface of a first metal foil to create a first contact location between at least a portion of the first surface of the first glass ceramic substrate and the first surface of the first metal foil; and conducting a first welding step by directing a laser beam on at least a portion of the first contact location to bond the first glass ceramic substrate to the first metal foil and form a first bond location and a package. The first glass ceramic substrate has a thickness greater than or equal to 20 μm and less than or equal to 250 μm. The laser beam comprises a pulsed laser comprising a wavelength greater than or equal to 250 nm and less than or equal to 2 μm.