Glass-Ceramic Substrate for LED Heat Dissipation
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Solution Overview
Problem
Optoelectronic semiconductor components, such as LEDs, face inefficiencies due to poor heat dissipation caused by the use of silicone as a substrate for phosphor, which limits their performance and service life.
Innovation Solution
Replacing organic materials with glass or ceramic substrates that offer better thermal conductivity and UV resistance, and employing thin, translucent or transparent ceramic or glass-ceramic films with low bubble content to enhance heat dissipation and phosphor integration, allowing for efficient phosphor sinking at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicone is used as substrate for phosphor, then ease of manufacture is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent uses glass-ceramic composite material that combines the benefits of glass (good optical properties, ease of processing) and ceramic (excellent thermal conductivity, mechanical strength). This composite material resolves the contradiction by providing both manufacturability and superior heat dissipation performance.
Solution Approach 2:
The patent changes the material parameters by transitioning from organic silicone to inorganic glass-ceramic, fundamentally altering thermal conductivity, mechanical strength, and chemical stability parameters while maintaining manufacturability through controlled processing parameters.
2Manufacturing precision
If glass layer thickness is increased, then phosphor integration is improved, but lateral radiation increases
Solution Approach 1:
The patent employs a thin glass layer (optimizing thickness parameter) that acts as a flexible matrix for phosphor integration while minimizing lateral radiation. The thin film approach allows sufficient phosphor embedding while reducing the path length for unwanted lateral light propagation.
Solution Approach 2:
The glass layer is designed with specific local properties: sufficient thickness at phosphor-containing regions for proper integration, but optimized to be thin enough to minimize lateral radiation. This spatial variation in effective thickness resolves the contradiction between integration quality and radiation control.
3Stability of the object's composition
If phosphor sinking temperature is increased, then glass matrix density is improved, but phosphor damage occurs
Solution Approach 1:
The patent performs preliminary preparation of the glass matrix structure before phosphor sinking, creating a pre-formed glass-ceramic substrate with optimized density and structural integrity. This preliminary action allows subsequent phosphor embedding at lower temperatures, preventing phosphor damage while maintaining matrix density.
Solution Approach 2:
The patent utilizes controlled phase transitions of the glass-ceramic material during processing. By carefully managing the thermal history and phase transformation sequences, the glass matrix achieves high density through controlled crystallization while keeping the final phosphor sinking temperature low enough to preserve phosphor integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the efficiency and service life of LEDs by enhancing heat dissipation and reducing lateral radiation, while maintaining phosphor integrity and homogeneity of radiation across angles.
Implementation Method 1
glass and ceramic or glass ceramic, which have better thermal conductivity
Implementation Method 2
luminescence conversion LED using a phosphor embedded in glass
Data Source
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AI summary
The optoelectronic semiconductor component uses a luminescent substance, which is applied to a conversion element. The conversion element has a substrate made of ceramic, to which a glass matrix is applied.