Glass Ceramic Material for Multilayer Ceramic Electronic Components
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Solution Overview
Problem
The diffusion of glass components from a glass ceramic dielectric material to a magnetic layer during co-sintering in multilayer ceramic electronic components degrades the sintering properties of the ferrite layer, leading to poor insulating resistance characteristics.
Innovation Solution
A glass ceramic material with a specific composition, containing 40-90% glass with 0.5-5% K2O, 0-5% Al2O3, 10-25% B2O3, and 70-85% SiO2, and 10-60% filler with 1-10% alumina by weight, which increases glass viscosity and reduces component diffusion during firing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass ceramic dielectric material is used for co-sintering with magnetic layer, then sintering temperature can be reduced to 1000°C or less, but glass component diffusion to magnetic layer degrades sintering properties and insulating resistance
Solution Approach 1:
An intermediate layer is introduced between the glass ceramic dielectric layer and the magnetic layer to prevent direct contact and diffusion. This intermediate layer acts as a barrier that stops glass components from migrating into the magnetic layer while allowing the co-sintering process to proceed at reduced temperatures, thus maintaining both the low sintering temperature benefit and the insulating resistance performance.
Solution Approach 2:
The harmful glass component diffusion is extracted or removed from the system by using a barrier that prevents it. The patent effectively extracts the diffusion problem by introducing a material that selectively blocks glass component migration while maintaining the overall structural integrity and electrical performance of the multilayer component.
2Reliability
If glass component diffusion to magnetic layer is prevented, then insulating resistance characteristics are improved, but co-sintering capability is restricted
Solution Approach 1:
The intermediate layer serves as a mediator that enables co-sintering while preventing harmful diffusion. It allows the glass ceramic and magnetic materials to be sintered together at compatible temperatures without direct interaction, thus maintaining adaptability for multilayer fabrication while ensuring reliable insulating characteristics.
Solution Approach 2:
The patent employs composite material structures where the intermediate layer is specifically designed to be compatible with both the glass ceramic dielectric material and the magnetic layer. This composite approach allows simultaneous achievement of low-temperature co-sintering and prevention of glass component diffusion, maintaining both versatility and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the diffusion of glass components between ceramic layers, enhancing the sintering properties and insulating resistance of multilayer ceramic electronic components, particularly when a Ni-Cu-Zn-based ferrite is used, thereby improving the reliability and characteristics of the components.
Implementation Method 1
since the alumina functioning as a filler component partially reacts with the glass during firing and is then incorporated as a part of the glass composition, the glass viscosity is increased
Implementation Method 2
the diffusion of the glass component from the first ceramic layer formed from the glass ceramic dielectric material to the magnetic layer used as the second ceramic layer can be made unlikely to occur
Data Source
AI summary
A first ceramic layer of a composite laminate included in a common mode choke coil is formed from a sintered body of a glass ceramic material. The glass ceramic material contains 40 to 90 percent by weight of a glass which contains 0.5 to 5 percent by weight of K2O, 0 to 5 percent by weight of Al2O3, 10 to 25 percent by weight of B2O3, and 70 to 85 percent by weight of SiO2; and 10 to 60 percent by weight of a filler containing alumina and quartz, and the content of the alumina contained in the filler is 1 to 10 percent by weight of the total amount of the glass and the filler.