Glass Chiplet Photonics Interposer for Precise EPIC Coupling
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Solution Overview
Problem
Integrating photonics into electronic integrated circuits is challenging due to misalignment and damage of optical components during fabrication, excessive energy consumption, and interconnection issues with optical fibers.
Innovation Solution
The integration of an interposer structure with a glass chiplet and an electrical and photonic integrated circuit (EPIC) using evanescent coupling, where the waveguide of the glass chiplet is prefabricated and coupled to the EPIC, minimizing exposure to harmful fabrication processes and eliminating the need for v-groove alignment techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical components are integrated into electronic IC packages, then bandwidth and latency performance is improved, but fabrication complexity and alignment precision requirements increase
Solution Approach 1:
The system is divided into separate electronic IC package and optical component modules that can be fabricated independently and then interconnected. This segmentation allows each module to be optimized separately, reducing the overall manufacturing precision requirements while maintaining high data transmission speed.
Solution Approach 2:
An intermediary coupling structure is introduced between the optical components and electronic IC package. This intermediary serves as a buffer that accommodates alignment tolerances and reduces the direct precision requirements between the optical components and electronic circuits, enabling high-speed transmission without excessive fabrication complexity.
2Quantity of substance
If optical components are integrated into electronic IC packages, then bandwidth is improved, but device complexity increases
Solution Approach 1:
By segmenting the system into separate electronic and optical modules, the fabrication processes can be optimized independently. This reduces the overall device complexity compared to fully integrated photonic-electronic circuits, while still achieving high bandwidth throughput through the interconnection of specialized modules.
Solution Approach 2:
The interposer structure serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and optical coupling. This multi-functionality reduces the need for separate specialized components and simplifies the overall device architecture, enabling high data throughput without proportionally increasing fabrication complexity.
3Manufacturing precision
If traditional alignment techniques are used, then manufacturing precision is improved, but energy consumption increases
Solution Approach 1:
The coupling structure incorporates self-aligning features that automatically position optical components relative to the electronic IC package without requiring complex external alignment equipment or processes. This self-service approach maintains manufacturing precision while reducing the energy consumption associated with active alignment systems and complex fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces transmission losses and facilitates scalable, pluggable optics in 2.5D packaging architectures, ensuring precise alignment and mechanical stability while reducing energy consumption.
Implementation Method 1
The integration of an interposer structure with a glass chiplet and an electrical and photonic integrated circuit (EPIC) using evanescent coupling, where the waveguide of the glass chiplet is prefabricated and coupled to the EPIC
Data Source
AI summary
Examples herein describe integrated photonics circuitry. The integrated photonics circuitry includes an interposer structure mounted on a substrate, a glass chiplet of the interposer structure, and an electrical and photonic integrated circuit (EPIC). The EPIC has a first portion disposed on the glass chiplet and a second portion disposed over the substrate. The glass chiplet includes a waveguide. The waveguide is coupled to the EPIC.