Glass Circuit Assembly for Densely Packed Electronic Systems
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Solution Overview
Problem
Current electronic systems face challenges in achieving high spatial and power densities while effectively managing heat dissipation, particularly in densely packed circuits, and lack adaptive capabilities to varying workloads.
Innovation Solution
The development of printed circuit board assemblies (PCBAs) using flip chip assembly methods on glass substrates with thermal interface materials for optimized cooling, combined with reconfigurable systems that can dynamically adjust components based on workload demands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If packaged devices are mounted on printed circuit boards, then spatial density is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts the packaging structure from the mounting solution by mounting bare die directly on the printed circuit board, eliminating the intermediate package layer that would increase thermal resistance and occupy additional space
Solution Approach 2:
The patent segments the thermal management approach by implementing dedicated heat sinks and thermal vias directly beneath each bare die component, allowing localized heat dissipation rather than relying on board-level thermal management
2Quantity of substance
If bare die are mounted on printed circuit board, then chip density increases, but heat dissipation requirements become more stringent
Solution Approach 1:
The patent merges thermal management functions directly into the PCB structure by integrating thermal vias, heat sinks, and cooling channels into the board design itself, eliminating the need for separate external cooling systems
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional thermal management by implementing multi-layer PCB structures with internal thermal vias and stacked heat sink configurations that conduct heat through the thickness of the board
3Ease of manufacture
If fixed configuration systems are used, then manufacturing is simpler, but adaptability to varying workloads is reduced
Solution Approach 1:
The patent implements dynamic reconfigurability through field-programmable gate arrays (FPGAs) and switchable component arrays that can be programmatically reconfigured to optimize system performance for different workload types and intensity levels
Solution Approach 2:
The patent creates universal computing resources that can perform multiple functions through reconfiguration, allowing the same physical hardware to adapt to various computational tasks including general-purpose computing, graphics processing, and specialized accelerations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables higher power densities and improved heat dissipation, allowing for efficient operation across varying workloads and maintaining safe temperatures, while also enhancing system flexibility and reliability.
Implementation Method 1
The back side of mounted components may be back-ground and polished to form a highly polished planar surface that is bonded to a cooling surface using a thermal interface material
Data Source
AI summary
A glass circuit assembly employing densely packed components is described. Air cooled computer systems employing densely packed circuit components are described. Relating to agile reconfigurable computer systems a high-resolution substrate having an area of at least 100 cm2 and selected traces having a line/space dimension of 2 micrometers or less is employed to integrate multiple independently operable clusters of flip chip mounted components in a circuit assembly. Switchable chips and redundant switchable chips may be included on each circuit assembly. Each independently operable cluster of components may include a power distribution chip, a test/monitor chip, and at least one redundant chip for each different logic device and for each different memory device. Chiplet components and combinations may be used to populate independently operable clusters of components. Agile reconfigurable systems are operable to adapt to changing workloads under direction of a system controller.