Laminate Sheet With Glass Clad Envelope For Semiconductor Cores
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Solution Overview
Problem
Current methods for producing laminate sheet articles with a non-glass core and glass clad envelope face limitations, particularly in achieving compatible thermal expansion coefficients and maintaining pristine exterior surfaces, especially when using materials like silicon, germanium, or GaAs, which require specific viscosity and melting point conditions.
Innovation Solution
A double crucible apparatus and method that involves slot extrusion of a non-glass core and simultaneous fusion drawing of a glass clad layer around the core, with vertically adjustable crucibles to control layer thickness and viscosity, and optional cooling or heating treatments to enhance crystallinity and surface quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to produce laminate sheet articles with non-glass core and glass clad envelope, then production can proceed with standard processes, but achieving compatible thermal expansion coefficients and maintaining pristine exterior surfaces becomes difficult
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the chemical composition of the glass clad layer to match the thermal expansion coefficient of the non-glass core material. By adjusting oxide ratios (such as SiO2, B2O3, Al2O3) in the glass composition, the thermal expansion properties are tuned to be compatible with semiconductor materials like silicon, germanium, or GaAs, preventing delamination during thermal cycling while maintaining production feasibility
Solution Approach 2:
The glass clad layer serves as an intermediary between the non-glass core and the external environment. This intermediate layer not only provides thermal expansion compatibility but also acts as a protective barrier that maintains pristine exterior surfaces, preventing direct exposure of the core material to environmental factors while enabling standard production processes
2Adaptability or versatility
If materials like silicon, germanium, or GaAs are used for the core layer, then semiconductor applications are enabled, but specific viscosity and melting point conditions must be maintained
Solution Approach 1:
The patent employs parameter changes by controlling the viscosity and melting point of the glass clad layer relative to the core material. The glass composition is formulated so that its melting point and viscosity characteristics are compatible with the semiconductor materials used, allowing the glass to properly envelop the core during the lamination process while maintaining the structural integrity required for semiconductor applications
Solution Approach 2:
The invention creates a composite structure combining non-glass semiconductor core materials with glass clad envelope materials. This composite approach enables the integration of materials with vastly different properties (semiconductor and glass) by ensuring their thermal, mechanical, and viscous properties are compatible during processing, thereby enabling semiconductor applications while maintaining manufacturing precision
3Reliability
If the glass clad envelope completely surrounds the core on all sides, then protection and encapsulation are maximized, but the complexity of achieving uniform thickness and coverage increases
Solution Approach 1:
The patent applies dynamics by using a liquid or semi-liquid glass clad material during the lamination process that can flow and adapt to completely surround the core on all sides. The glass is applied in a state that allows it to dynamically conform to the core geometry, ensuring complete encapsulation and uniform thickness through controlled flow rather than rigid positioning
Solution Approach 2:
The invention utilizes phase transitions of the glass material, applying it in a liquid or soft state that enables complete and uniform envelopment of the core, then allowing it to cool and solidify into a rigid protective envelope. This phase change from liquid to solid ensures the glass can achieve complete coverage with uniform thickness while simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of laminate sheets with a glass clad envelope that surrounds the core on all sides, maintaining low thermal expansion differences and pristine surfaces, suitable for semiconductor applications, and allowing for new architectures in semiconductor devices.
Implementation Method 1
a fusion draw portion for producing a glass clad envelope surrounding the non-glass core layer
Implementation Method 2
vertically adjustable crucibles to control layer thickness and viscosity
Implementation Method 3
optional cooling or heating treatments to enhance crystallinity and surface quality
Implementation Method 4
optional cooling or heating treatments to enhance crystallinity and surface quality
Data Source
AI summary
A laminate sheet article including: a core including an electrical semi-conductor or an electrical conductor; and a continuous glass clad layer on at least four of six sides the core of the sheet article. Also disclosed is an apparatus for making a sheet laminate article as defined herein. Also disclosed is a method of making and using the article.