Glass Clad Microelectronic Substrate High Density Interconnects
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Solution Overview
Problem
Current microelectronic substrates face challenges in achieving high density, ultra-thinness, and hermeticity for reliable electrical communication between microelectronic devices and external components, while maintaining stress balance and compatibility with moisture-sensitive low-K, low-loss dielectric materials.
Innovation Solution
The development of microelectronic substrates with a trace routing structure disposed between opposing glass layers, comprising dielectric layers with conductive traces and through-glass contact structures, which allows for high-density interconnections and ultra-thinness, achieved through specific fabrication processes involving glass materials and surface treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional substrates are used to achieve high density interconnections, then interconnection density is improved, but substrate thickness cannot be reduced to ultra-thin levels while maintaining structural integrity
Solution Approach 1:
The substrate employs a composite structure combining glass layers with dielectric materials containing low-K, low-loss properties. This composite approach enables ultra-thin profile (less than 0.010 inch) while maintaining mechanical integrity and supporting high-density interconnections through the glass-clad architecture.
Solution Approach 2:
The glass layers serve as thin film structures that provide both mechanical support and hermetic sealing. The glass-clad configuration allows the substrate to achieve ultra-thin dimensions while the glass layers maintain structural integrity and protect the internal interconnection structures.
2Reliability
If hermetic sealing is implemented for moisture protection, then reliability is improved, but stress balance in the substrate structure deteriorates
Solution Approach 1:
The multi-layer composite structure including glass layers and dielectric materials with specific stress properties creates a stress-balanced configuration. The glass-clad architecture with hermetic sealing provides moisture protection while the composite nature of the layers compensates for thermal expansion differences, maintaining stress balance.
3Reliability
If low-K, low-loss dielectric materials are used for signal integrity, then electrical performance is improved, but sensitivity to moisture and environmental factors increases
Solution Approach 1:
The glass layers function as hermetic barriers that seal the low-K, low-loss dielectric materials from environmental moisture. The glass-clad structure provides protective encapsulation, allowing the use of moisture-sensitive dielectric materials while maintaining signal integrity through hermetic isolation.
4Length of stationary object
If ultra-thin substrate profile is achieved, then device miniaturization is improved, but manufacturing complexity and precision requirements increase
Solution Approach 1:
The manufacturing process utilizes parameter changes including temperature-controlled lamination and curing cycles to achieve precise bonding of ultra-thin glass layers. The glass-clad structure with controlled layer thicknesses and material properties enables ultra-thin profile (less than 0.010 inch) while managing fabrication precision through parameter optimization.
Data Source
AI summary
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.