Glass-Coated Conductive Paste for Low-Resistance Fine Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photosensitive conductive pastes for multilayer electronic components face issues with increased electrical resistance and reduced resolution due to non-conductive metal oxides, which also cause light scattering during photolithographic patterning, and the use of small conductive powders leads to higher surface area and further scattering.
Innovation Solution
A photosensitive conductive paste comprising a conductive powder covered with glass having a softening point of 800°C or lower, reducing shrinkage and electrical resistance by suppressing sintering until the glass softening point and promoting liquid-phase sintering thereafter, while minimizing powdery components to enhance resolution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If non-conductive metal oxides are contained in the photosensitive conductive paste, then the shrinkage percentage of the inner electrode during firing is reduced, but the electrical resistance of the inner electrode after firing is increased
Solution Approach 1:
The patent removes non-conductive metal oxides from the photosensitive conductive paste formulation. By extracting these harmful components, the paste achieves low shrinkage during firing without the penalty of increased electrical resistance, as the metal oxides that previously suppressed shrinkage are eliminated and replaced by a glass-based system.
Solution Approach 2:
The patent employs a composite material system consisting of conductive powder particles coated with glass material. This composite structure allows the glass to suppress shrinkage during firing while maintaining electrical conductivity, as the conductive powder core preserves low resistance even after sintering.
2Stability of the object's composition
If non-conductive metal oxides are contained in the photosensitive conductive paste, then the shrinkage percentage of the inner electrode during firing is reduced, but the resolution at the time of photolithographic patterning is decreased
Solution Approach 1:
The patent extracts non-conductive metal oxides from the paste formulation, eliminating their harmful light-scattering effect during photolithography. This extraction improves resolution by reducing optical interference while the glass-based shrinkage suppression mechanism maintains dimensional stability.
Solution Approach 2:
The patent utilizes glass material with controlled optical properties that minimize light scattering during photolithographic patterning. The glass coating on conductive powder particles has optical characteristics that allow clear pattern formation, improving resolution compared to metal oxide-based systems.
3Stability of the object's composition
If small conductive powder particles are used, then the shrinkage percentage of the inner electrode during firing is reduced, but the surface area of the conductive powder is increased causing light scattering
Solution Approach 1:
The patent applies different properties to different parts of the conductive powder system: small particle size for shrinkage control, but glass coating for optical property modification. The glass coating locally modifies the surface of each particle to reduce light scattering while maintaining the size benefits for shrinkage suppression.
Solution Approach 2:
The patent creates a composite structure where glass material coats small conductive powder particles. This composite approach allows the core particles to provide shrinkage suppression through small size, while the glass coating suppresses light scattering, simultaneously addressing both requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the shrinkage percentage of inner electrodes during firing, improves photolithographic resolution, and decreases electrical resistance of the inner electrodes after firing, thereby minimizing delamination and achieving a balanced low resistance and high precision in multilayer electronic components.
Implementation Method 1
the sintering of the conductive powder is suppressed until the firing temperature reaches the glass softening point of the glass
Implementation Method 2
a glass softening point (Ts) of 800° C. or lower
Implementation Method 3
the sintering of the conductive powder is promoted by liquid-phase sintering
Implementation Method 4
a photosensitive monomer
Data Source
AI summary
A photosensitive conductive paste includes a conductive powder, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, a dispersant, and a solvent. The conductive powder is covered with a glass having a glass softening point (Ts) of 800° C. or lower.