Near-Hermetic Glass Coating for Integrated Circuit Reliability
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Solution Overview
Problem
Current integrated circuit packages designed for benign environments fail when used in harsh military and avionics applications due to high operating temperatures and corrosion, and modifying them for improved corrosion resistance is costly and reduces reliability.
Innovation Solution
A method involving a low processing temperature, near-hermetic glass-based coating applied directly to integrated circuits and localized interconnect interfaces during assembly, which is then cured, providing a reliable solution for high-temperature and corrosive environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If COTS devices are used in military and avionics applications, then production cost is reduced, but reliability deteriorates due to higher operating temperatures and corrosion
Solution Approach 1:
The patent applies a glass-based coating that changes the protective parameters of the COTS device by providing a hermetic barrier layer. This coating modifies the environmental interaction parameters (corrosion resistance, moisture barrier) without changing the fundamental device structure, allowing COTS devices to operate reliably in harsh military and avionics environments while maintaining cost-effectiveness
Solution Approach 2:
The patent uses a composite structure combining the standard COTS device with a glass-based coating layer. This composite approach integrates the advantages of both the inexpensive COTS device and the protective properties of glass coatings, creating a hybrid solution that achieves hermetic protection at lower cost than traditional hermetic packages
2Object-affected harmful factors
If current methods are used to modify integrated circuit packages for improved corrosion resistance, then corrosion resistance is improved, but other failure mechanisms are exacerbated and reliability is reduced
Solution Approach 1:
The patent applies the glass-based coating specifically to localized interconnect interfaces and selected areas of the integrated circuit package rather than uniformly across the entire device. This localized application provides corrosion protection exactly where it is most needed (at interconnect interfaces susceptible to corrosion) while avoiding potential adverse effects on other device areas
Solution Approach 2:
The patent employs a thin-film glass-based coating that provides effective corrosion protection through a minimal barrier layer. This approach uses a relatively simple, cost-effective coating process that creates sufficient protection without the complexity and potential reliability issues of more aggressive corrosion modification methods
3Reliability
If hermetic packages are used for military and avionics applications, then reliability is improved for long lifespan, but production cost increases significantly
Solution Approach 1:
The patent segments the protection approach by applying hermetic coating only to critical areas (interconnect interfaces and specific device surfaces) rather than fully encapsulating the entire device. This segmented protection strategy achieves sufficient reliability for military and avionics applications while reducing material usage and production complexity compared to complete hermetic packaging
Solution Approach 2:
The patent modifies the protective parameters of standard COTS devices by applying a glass-based coating that enhances corrosion resistance and provides hermetic protection. This parameter change allows the device to meet military reliability requirements without adopting the expensive fully hermetic package structure, achieving cost-effective protection through targeted property modification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the reliability of integrated circuit assemblies by providing corrosion resistance and maintaining functionality in harsh environments without increasing production costs, thereby extending the lifespan of the components.
Implementation Method 1
applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface
Implementation Method 2
curing the coating
Data Source
AI summary
The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly. The method further includes curing the coating. Further, the integrated circuit may be a device which is available for at least one of sale, lease and license to a general public, such as a Commercial off the Shelf (COTS) device. Still further, the coating may promote corrosion resistance and reliability of the integrated circuit assembly.