Glass Component Bonding Through Aperture-Fed Curing Compound

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Solution Overview

Problem

The existing methods for connecting components to glass panels, such as in the automotive sector, are complex and expensive due to the need for precise cleaning, primer application, and compatibility between materials, which limits the choice of component materials and requires lengthy drying times for adhesives.

Innovation Solution

A method involving a component with a connection side positioned at a distance from the panel, where a compound in liquid form is applied through an opening to fill a zone between the component and the panel, forming a physical barrier and a further zone above the opening, allowing mechanical holding after curing, independent of adhesive compatibility between the component and panel.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a glue is used to connect the component to the glass panel, then the component can be connected without perforation, but the drying time is long (one or more hours) and the process is complex

Engineering Contradiction:
Improveconnection process simplicityVSAvoiddrying time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The patent changes the physical-chemical parameters of the adhesive compound by selecting specific compounds with faster curing characteristics. The compound is applied in a controlled manner through an opening to ensure proper distribution and bonding, achieving reliable connection in significantly reduced time compared to conventional glues.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The component is prepared in advance with an opening and a raised portion that will guide and contain the adhesive compound. This preliminary structuring ensures that when the compound is applied, it is automatically positioned correctly and distributed evenly, eliminating the need for complex application procedures and reducing overall connection time.

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If a glue is used to connect the component to the glass panel, then connection without perforation is achieved, but material compatibility requirements limit the choice of component materials

Engineering Contradiction:
Improvematerial choice flexibilityVSAvoidmaterial compatibility constraints
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The adhesive compound serves multiple functions: it provides structural bonding, accommodates different material types (glass, plastic, metal), and allows for various component designs. The compound formulation and application method are universally applicable across different material combinations, eliminating the need for material-specific adhesive selections.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The adhesive compound acts as an intermediary substance that mediates between the component and the glass panel regardless of their material composition. The compound's formulation allows it to bond effectively to diverse materials without requiring specific compatibility between the component material and the glass, thus enabling universal application.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If the connection side is held at a distance from the panel using spacers, then sufficient glue thickness is achieved, but the process complexity increases

Engineering Contradiction:
Improvebond line thickness controlVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The raised portion of the component structure serves a dual function: it maintains the necessary distance between the connection side and the panel while simultaneously guiding and containing the adhesive compound. This self-structuring eliminates the need for separate spacers and simplifies the overall assembly process.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent merges the spacer function and the adhesive containment function into a single integrated structure (the raised portion). This consolidation reduces the number of separate components and simplifies the assembly process while maintaining precise control over bond line thickness.

Inventive Principle:
Principle #5Merging (Combining)

4Strength

If the glass and component are cleaned and primed to maximum extent, then good bond strength is achieved, but the manufacturing cost and time increase

Engineering Contradiction:
Improvebond strengthVSAvoidmanufacturing efficiency
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent modifies the parameters of the adhesive compound to achieve optimal bonding performance with minimal surface preparation. The compound formulation is designed to adhere effectively to surfaces with standard cleaning procedures, eliminating the need for extensive priming and cleaning operations while maintaining strong bonds.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the connection process by eliminating the need for precise material compatibility and reduces the complexity and cost by allowing faster connection with shorter curing times, enabling the use of cheaper materials and easier manufacturing processes.

Implementation Method 1

a compound in liquid form is applied above the opening so as to flow through the opening and fill the zone

Methodology Applied
Scientific EffectGravity: Gravitation

Implementation Method 2

after at least partial curing of the compound, the component is held mechanically by the compound

Methodology Applied
Scientific EffectCuring: Phase Change

Data Source

PatentEP3762620B1Connecting a component to glass
Publication Date: 2022.09.28 EXYPNOS BVBA
  • EP3762620B1 patent drawingFigure 1~2
  • EP3762620B1 patent drawingFigure 3~4
  • EP3762620B1 patent drawingFigure 5A~6

AI summary

Method for connecting a component (1) to a panel (2), wherein the component (1) comprises a connection side (4) which is positioned at a distance (d) from the panel (2) and wherein a glue layer is introduced between the connection side (4) and the panel (2), characterized in that a zone (5) is delimited between the connection side and the panel such that a physical barrier (6) is formed for the glue layer, which zone (5) has at least an opening (7) in the connection side, and wherein a compound (11) is applied above the opening so as to flow through the opening (7) and fill the zone (5) so that the glue layer is formed, wherein above said opening a further zone (8) is at least partially filled by the compound (11) such that, after at least partial curing of the compound (11), the component (1) is held mechanically by the compound (11).