Glass Composition for Etching Rate and HCl Resistance
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Solution Overview
Problem
Conventional glass substrates for OLED and liquid crystal displays face challenges with low etching rates in HF-based chemicals, leading to uneven etching and particle adhesion, while reducing SiO2 content to enhance etching rates compromises HCl resistance and strain point, causing thermal shrinkage and pattern distortion.
Innovation Solution
A glass composition with restricted SiO2, Al2O3, B2O3, and P2O5 content, along with specific molar ratios and component balances, enhances etching rates, HCl resistance, and strain point, ensuring uniform etching and stability for display substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the concentration of HF in the chemical is increased to increase the etching rate, then the etching rate is improved, but insoluble fine particles are increased and etching uniformity is impaired
Solution Approach 1:
The patent changes the chemical composition parameters by adding specific additives (ammonium fluoride and organic fluoride) to the HF-based etching solution. This modifies the etching chemistry to achieve high etching rates without generating fine particles, thereby maintaining etching uniformity. The additive concentration ratios are precisely controlled to optimize the etching performance.
2Productivity
If the content of SiO2 is reduced in the glass composition to increase the etching rate, then the etching rate is improved, but HCl resistance and strain point are liable to lower
Solution Approach 1:
The patent modifies the glass composition parameters by precisely controlling the SiO2 content within 40-70 mass% and adjusting the ratios of other components (Al2O3, B2O3, RO, P2O5). This optimized composition range achieves high etching rates while maintaining adequate HCl resistance and strain point, resolving the contradiction between etching speed and chemical/thermal stability.
3Productivity
If the content of SiO2 is reduced in the glass composition to increase the etching rate, then the etching rate is improved, but thermal shrinkage increases and pattern distortion is liable to occur
Solution Approach 1:
The patent optimizes the glass composition parameters including SiO2 (40-70 mass%), Al2O3 (10-30 mass%), B2O3 (0-10 mass%), and the molar ratio (MgO+CaO+SrO+BaO)/Al2O3 (0.5-2.0). This controlled composition range achieves high etching rates while maintaining low thermal shrinkage and high strain point, preventing pattern distortion during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized glass composition achieves a higher etching rate, improved HCl resistance, and increased strain point, reducing thermal shrinkage and pattern distortion, making it suitable for high-definition displays driven by LTPS or oxide TFTs.
Implementation Method 1
chemical etching is employed in order to reduce the thickness of the display. This method involves immersing a display panel obtained by bonding two glass substrates in a hydrofluoric acid (HF)-based chemical to reduce the thicknesses of the glass substrates.
Implementation Method 2
When the glass substrate has low HCl resistance, white turbidity is liable to occur in the glass substrate or a reaction product is liable to adhere onto a glass surface in a step of, after forming a metal film for wiring or the like on the glass substrate, removing the unnecessary metal film with a HCl aqueous solution.
Implementation Method 3
When the glass substrate has a low strain point, thermal shrinkage of the glass substrate increases in a production process of a p-Si.TFT, and pattern distortion is liable to occur.
Data Source
AI summary
A glass of the present invention includes as a glass composition, in terms of mass %, 50% to 65% of SiO2, 15% to 26% of Al2O3, 0% to 5% of B2O3, 0% to 5% of MgO, 0% to 10% of CaO, 0% to 10% of SrO, 0% to 15% of BaO, and 0.01% to 15% of P2O5, has a molar ratio (MgO+CaO+SrO+BaO)/Al2O3 of from 0.5 to 1.5, and satisfies a relationship of {[B2O3]+3×[P2O5]}≤18.5 mol %.