Glass Substrate Conductor Roughness for Low-Loss Protective Films
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Solution Overview
Problem
Conventional electronic components with glass substrates face issues of high frequency signal loss and protective film peeling due to weak adhesion caused by the smooth surface of the glass substrate, which becomes exacerbated when the outer surface conductor surface becomes rough, concentrating current and increasing signal loss.
Innovation Solution
The electronic component features a glass substrate with specific surface roughness values at different interfaces, ensuring that the surface roughness of the outer surface conductor is closer to the glass substrate than the protective film, reducing current concentration and signal loss while improving adhesion, thereby minimizing peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the outer surface of the glass substrate is made rough to improve adhesion of the protective film, then the adhesion between the protective film and glass substrate is improved, but the surface roughness of the outer surface conductor increases causing current concentration and increased loss of high frequency signal
Solution Approach 1:
The patent applies different surface roughness characteristics to different regions: the glass substrate has controlled roughness (Ra1) at the conductor interface and different roughness (Ra2) at the protective film interface, while the outer surface conductor maintains smooth surfaces (Ra3) for signal transmission regions. This local differentiation allows simultaneous optimization of adhesion and signal loss prevention
Solution Approach 2:
The patent optimizes specific surface roughness parameter values to resolve the contradiction. By controlling Ra1, Ra2, and Ra3 within specific ranges and establishing their relationships (Ra1 < Ra2 and Ra3 - Ra1 < Ra2 - Ra3), the patent achieves both improved adhesion and reduced signal loss through precise parameter management
2Loss of energy
If the outer surface of the glass substrate is kept smooth to reduce current concentration and signal loss, then the loss of high frequency signal is reduced, but the adhesion between the protective film and glass substrate becomes weak causing peeling
Solution Approach 1:
Different regions of the glass substrate are given different surface properties: the region contacting the outer surface conductor maintains smoothness (Ra1) for low signal loss, while the region contacting the protective film has controlled roughness (Ra2) for good adhesion. This spatial differentiation resolves the contradiction
Solution Approach 2:
The patent creates a composite interface structure where the glass substrate, outer surface conductor, and protective film form a multi-layer system with optimized interfacial properties. The specific roughness relationships between layers work together to achieve both low signal loss and high adhesion simultaneously
Data Source
AI summary
An electronic component includes a glass substrate, an outer surface conductor that is in contact with an outer surface of the glass substrate, and a protective film that covers the outer surface of the glass substrate and the outer surface conductor and is in contact with the outer surface of the glass substrate and the outer surface conductor. When the glass substrate has first surface roughness Ra1 at an interface between the glass substrate and the outer surface conductor, the glass substrate has second surface roughness Ra2 at an interface between the glass substrate and the protective film, and the outer surface conductor has third surface roughness Ra3 at an interface between the outer surface conductor and the protective film, Ra1<Ra3<Ra2 is satisfied.