Glass Core Packaging Substrate Curing for Alignment Stability
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in alignment and positional stability of alignment marks on build-up layers, and the influence of insulative material shrinkage, which affect the electrical performance of semiconductor devices.
Innovation Solution
A method of manufacturing a packaging substrate using a glass core with core vias, forming metal layers, and curing insulative material layers at specific temperature ranges to minimize shrinkage and improve alignment, involving pre-curing and post-curing processes to create re-distribution layers with precise alignment marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulative material is applied on metal layers to form build-up layers, then electrical insulation is achieved, but shrinkage of the insulative material causes misalignment of alignment marks
Solution Approach 1:
The patent applies parameter changes by controlling the curing temperature and humidity conditions during the insulative material application process. Specifically, the material is cured at temperatures below its glass transition temperature (Tg) to minimize shrinkage, and humidity is controlled to prevent excessive shrinkage. This parameter control resolves the contradiction by maintaining both electrical insulation and alignment mark positional stability.
Solution Approach 2:
The patent uses preliminary action by pre-forming alignment marks on the glass core before applying the insulative material. The alignment marks are established in advance on a stable substrate (glass core with low shrinkage), so that even when insulative material is applied and cured, the pre-existing alignment marks remain stable reference points for subsequent layer alignment, thus resolving the misalignment issue.
2Reliability
If conventional curing processes are used for insulative material, then complete curing is achieved, but excessive shrinkage occurs causing alignment mark displacement
Solution Approach 1:
The patent applies preliminary action by performing a pre-curing process at elevated temperature and humidity before the final curing step. This pre-curing removes excess moisture from the insulative material, preventing excessive shrinkage during subsequent curing. The alignment marks are also pre-established on the glass core before insulative material application, providing stable reference points that maintain their positions throughout the multi-stage curing process.
Solution Approach 2:
The patent uses periodic action by implementing a multi-stage curing process with different temperature and humidity conditions. The curing is performed in periods: first at elevated temperature and humidity for pre-curing, then at controlled lower temperature for final curing. This periodic approach allows complete curing while minimizing shrinkage-induced alignment mark displacement by controlling the curing conditions in stages.
3Stability of the object's composition
If glass core is used instead of ceramic or resin, then thermal stability and low shrinkage are achieved, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by selecting glass as the core material, which has fundamentally different thermal and shrinkage properties compared to ceramic or resin. Glass provides superior thermal stability and minimal shrinkage during curing. The manufacturing complexity is managed by establishing alignment marks directly on the glass core surface and controlling the insulative material curing parameters to match glass's low-shrinkage characteristics, thus achieving both thermal stability and manageable manufacturing complexity.
4Ease of manufacture
If alignment marks are formed on build-up layers after insulative material application, then layer integration is achieved, but alignment accuracy deteriorates due to shrinkage
Solution Approach 1:
The patent applies preliminary action by forming alignment marks on the glass core before applying the insulative material, rather than forming them after. This ensures that the alignment marks are established on a stable, low-shrinkage substrate before the insulative material is applied and cured. The marks serve as permanent reference points that maintain their positions throughout the layer integration process, achieving both ease of manufacture and high alignment accuracy.
Solution Approach 2:
The patent uses the glass core as an intermediary that provides a stable platform for alignment marks. The glass core acts as a mediator between the insulative material layers, providing a reference framework that is not affected by the shrinkage of the insulative material. This intermediary approach allows layer integration to proceed with high alignment accuracy, as the glass core's stability transfers to the entire multi-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the alignment and positional stability of alignment marks, reduces shrinkage, and improves electrical performance by providing faster signal transmission and lower loss in semiconductor devices.
Implementation Method 1
The pre-curing process may be performed by sequentially implementing a first step and a second step. The first step may be heat treatment performed for 10 minutes or longer at a temperature of about 110 °C or higher but lower than about 150 °C.
Implementation Method 2
a method of manufacturing a packaging substrate capable of minimizing or preventing the influence of shrinkage of an insulative material
Implementation Method 3
The second step may be heat treatment performed for 10 minutes or longer at a temperature of about 150 °C or higher but lower than about 175 °C.
Implementation Method 4
a method of manufacturing a packaging substrate capable of minimizing or preventing the influence of shrinkage of an insulative material
Data Source
Figure 1~2
Figure 3(a)~3(b)
Figure 4(a)~4(e)
AI summary
Disclosed is a method of manufacturing a substrate including a packaging substrate. The method includes an operation of preparing a glass core having core vias, a 1-1st operation of forming a first metal layer on the glass core, a 1-2nd operation of laminating a first insulative material layer on the first metal layer, a 1-3rd operation of curing the first insulative material layer to prepare a first insulating layer, a 2-1st operation of forming a second metal layer on the first insulative material layer so as to be electrically connected to the first metal layer, and a 2-2nd operation of laminating a second insulative material layer on the second metal layer. The 1-3rd operation includes pre-curing the first insulative material layer at a temperature of 80 °C or higher but lower than 175 °C and post-curing the first insulative material layer at a temperature of 175 °C to 230 °C.