Glass Core Package Substrates With Buffer Layers for Crack-Free Singulation

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Solution Overview

Problem

The manufacturing process for semiconductor packaging substrates with glass cores is hindered by the tendency of glass cores to crack and develop defects during the singulation process, which is typically used for panel-level manufacturing of individual units.

Innovation Solution

The implementation of a buffer layer, such as a molding material or epoxy, around the glass core to protect it during singulation, replacing the glass edge surface with a material that can withstand the forces induced during cutting, thereby reducing defects and enabling high-yielding, robust, and cost-effective production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a saw is used to singulate glass core units from a panel, then individual units can be separated for packaging, but cracks and defects are generated in the glass core

Engineering Contradiction:

Improvepanel-level manufacturing efficiencyVSAvoidglass core integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A buffer layer is deposited around the glass core units before the singulation process. This preliminary action protects the glass core edges from mechanical damage during sawing, preventing cracks and defects while still allowing efficient panel-level manufacturing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The buffer layer acts as a cushioning material that absorbs mechanical stresses and forces generated during the sawing process. By placing this protective layer beforehand, the glass core is shielded from direct contact with the saw blade, maintaining its structural integrity throughout fabrication

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Ease of manufacture

If glass cores are singulated without protection, then manufacturing process is simpler, but defect generation increases

Engineering Contradiction:

Improvesingulation process simplicityVSAvoidglass core defect rate

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The buffer layer serves as an intermediary material between the saw blade and the glass core. It mediates the mechanical interaction during singulation, protecting the glass from direct cutting forces while still allowing the simple sawing process to proceed effectively

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The structure becomes a composite of glass core and buffer layer materials. The buffer layer material is specifically chosen to be more resistant to sawing forces than glass, creating a composite structure that combines the beneficial properties of both materials for the singulation process

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250112136A1Glass core protection using peripheral buffer layers

Publication Date: 2025.04.03 INTEL CORP

AI summary

Embodiments disclosed herein include apparatuses with glass core package substrates. In an embodiment, an apparatus comprises a substrate with a first surface and a second surface opposite from the first surface. A sidewall is between the first surface and the second surface, and the substrate comprises a glass layer. In an embodiment, a via is provided through the substrate between the first surface and the second surface, and the via is electrically conductive. In an embodiment, a layer in contact with the sidewall of the substrate surrounds a perimeter of the substrate.