Glass Core Via Architecture With Dielectric Buffer for Warpage Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor packaging is warpage and stress-induced cracking due to thermal expansion mismatch between materials like Silicon and Copper, which affects the reliability and performance of glass core substrates used in integrated circuit apparatuses.
Innovation Solution
Incorporating a dielectric buffer layer, such as SiNx, SiOxNy, or SiC, between the glass core and metal vias/pads to reduce stress and improve adhesion, thereby enhancing the reliability and performance of glass core substrates by acting as an adhesion promoter and stress manager.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal vias and pads are directly contacted with glass core, then electrical connection is achieved, but stress-induced cracking and warpage occur due to thermal expansion mismatch
Solution Approach 1:
A dielectric buffer layer is introduced between the metal vias/pads and the glass core substrate. This intermediary layer acts as a stress manager that decouples the thermal expansion mismatch between metal and glass, preventing stress-induced cracking while maintaining electrical connectivity through the metal structures.
Solution Approach 2:
The patent employs a composite structure consisting of glass core substrate, dielectric buffer layer, and metal vias/pads. This multi-material composite approach allows each layer to fulfill its specific function: glass provides mechanical support, dielectric provides stress management and electrical isolation, and metal provides electrical connectivity, thereby resolving the contradiction between reliability and stress-induced cracking.
2Productivity
If glass core substrate is used for high I/O density, then bandwidth density increases, but warpage control becomes difficult due to material mismatches
Solution Approach 1:
The dielectric buffer layer serves as a mediator that compensates for the thermal expansion coefficient mismatch between glass and metal layers. By distributing and managing the thermal stress, this intermediary layer enables high I/O density configurations without excessive warpage, thus supporting high bandwidth density while maintaining shape stability.
Solution Approach 2:
The patent changes the physical and chemical parameters of the interface between glass and metal by introducing a dielectric layer with specific mechanical and thermal properties. This parameter change in the interface structure allows the substrate to accommodate high I/O density while controlling warpage through optimized stress distribution.
3Reliability
If metal vias are used for current transmission, then electrical connectivity is achieved, but adhesion failure occurs at the glass-metal interface
Solution Approach 1:
The dielectric buffer layer acts as an adhesion promoter and intermediary between the glass core and metal vias. This intermediate layer provides chemical and mechanical bonding interfaces that enhance the overall adhesion strength, preventing delamination and ensuring reliable electrical connectivity through the metal via structures.
Solution Approach 2:
The patent creates a composite interface structure with glass-dielectric-metal layers, where each material contributes its advantageous properties. The dielectric layer provides both adhesion to glass and compatibility with metal deposition, creating a robust multi-layer composite structure that enhances interface adhesion strength while maintaining electrical functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dielectric buffer layer reduces warpage, improves I/O density, and increases the maximum current handling ability and reliability of metal vias, leading to better product yield and performance in glass core substrates.
Implementation Method 1
a dielectric buffer layer between the glass core and metal vias/pads that reduces stress and improves adhesion
Data Source
AI summary
In one embodiment, a substrate includes a glass core layer defining a plurality of holes between a first side of the glass core layer and a second side of the glass core layer opposite the first side and a conductive metal inside the holes of the glass core layer. The conductive metal electrically couples the first side of the glass core layer and the second side of the glass core layer. The substrate also includes a dielectric material between the conductive metal and the inside surfaces of the holes of the glass core layer.