Glass Core Capacitor Embedding With Recessed Alignment Platform
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of embedding a deep trench capacitor within a glass core substrate is exacerbated by the thickness mismatch between the capacitor and the core, leading to misalignment, rotational shifting, and processing challenges due to the use of adhesives and encapsulants, which can result in misalignment and mechanical stress.
Innovation Solution
The solution involves creating a recessed surface or platform in the glass core to support the deep trench capacitor at a suitable height and alignment, using laser or wet etching to pattern platforms of varying heights and shapes, and incorporating a through glass via to enhance stability and signal routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a deep trench capacitor is embedded in a glass core substrate, then the capacitance function is achieved, but thickness mismatch causes misalignment and mechanical stress
Solution Approach 1:
A recessed surface or platform is created in the glass core substrate before embedding the capacitor. This preliminary structural preparation compensates for the thickness mismatch between the capacitor and substrate, ensuring proper alignment and reducing mechanical stress during the embedding process
Solution Approach 2:
The glass core substrate is modified locally by creating a recessed surface or platform at the specific location where the capacitor will be embedded. This localized structural change allows the capacitor to be properly supported and aligned without affecting the overall substrate integrity
2Stability of the object's composition
If adhesives and encapsulants are used to embed the capacitor, then the capacitor is secured, but misalignment and mechanical stress occur
Solution Approach 1:
The recessed surface or platform is formed in advance within the glass core substrate, providing a pre-configured support structure that maintains capacitor alignment without relying solely on adhesives and encapsulants, thereby reducing misalignment and mechanical stress
Solution Approach 2:
The recessed surface or platform acts as an intermediary structural element between the capacitor and the glass core substrate. It provides mechanical support and alignment reference, reducing the dependency on adhesives and encapsulants for positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise alignment of the capacitor with the glass core, reducing misalignment and mechanical stress, thereby improving the electrical connection and overall capacitance of the IC package.
Implementation Method 1
using laser or wet etching to pattern platforms of varying heights and shapes
Implementation Method 2
using laser or wet etching to pattern platforms of varying heights and shapes
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods are disclosed to embed a semiconductor device in a glass core. An example apparatus comprises a package substrate comprising a glass core having a cavity in an outer surface of the glass core, the outer surface defining a first plane, and a semiconductor die attached to a surface of the cavity, the semiconductor die having contact pads on a surface of the semiconductor die, the contact pads arranged in a second plane, the second plane substantially coplanar with the first plane.