Glass Core Cavity Filter Structure for Low-Loss IC Packages

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving high-density interconnects and miniaturization for high-performance applications, particularly in integrating cavity filters within substrate packages to meet the demands of high-speed communication services at millimeter wave or RF frequencies, where existing solutions suffer from signal losses and yield issues.

Innovation Solution

The integration of cavity filters within a glass core substrate using a laser-assisted etching process, which allows for smaller dimensions, closer spacings, and improved alignment, enabling the formation of crack-free, high-density trenches and ridges lined with conductive material for efficient signal filtering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cavity filters are integrated within substrate packages using conventional methods, then signal filtering is achieved, but signal losses increase and manufacturing yield deteriorates

Engineering Contradiction:

Improvesignal filtering capabilityVSAvoidsignal loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent replaces conventional mechanical drilling and plating methods with laser-assisted etching to form trenches and ridges in the glass core. This substitution enables precise formation of cavity filter structures with controlled dimensions and spacing, reducing signal losses while improving manufacturing yield and reliability of the filtering function.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing parameters by using laser-assisted etching instead of conventional mechanical methods, allowing for smaller dimensions and closer spacings of trenches and ridges. This parameter change enables formation of high-density cavity filter structures that maintain signal integrity while achieving the required filtering performance.

Inventive Principle:

Principle #35Parameter changes

2Quantity of substance

If miniaturization is pursued for high-density interconnects, then bandwidth density increases, but manufacturing precision requirements worsen

Engineering Contradiction:

Improvebandwidth densityVSAvoidalignment precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical drilling and plating systems with laser-assisted etching, which provides superior precision and control for forming small-dimensional trenches and ridges. This enables manufacturing of high-density interconnect structures with closer spacings and improved alignment, achieving miniaturization while maintaining manufacturing precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the manufacturing approach by adopting laser-assisted etching, which allows for smaller dimensions and tighter tolerances. This enables creation of high-density cavity filter structures with improved alignment precision, supporting miniaturization for increased bandwidth density in 5G applications.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional etching methods are used for forming trenches and ridges, then manufacturing is simpler, but alignment precision and spacing control deteriorate

Engineering Contradiction:

Improveetching process simplicityVSAvoidalignment and spacing precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces conventional mechanical etching methods with laser-assisted etching, which provides precise control over trench and ridge formation. Although the process becomes more technologically advanced, it delivers superior alignment precision and spacing control, enabling high-density cavity filter structures with consistent dimensions and improved manufacturing quality.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances signal filtering capabilities, reduces signal losses, and increases the density of plated through-holes, addressing the need for miniaturization and high-density interconnects while maintaining low total thickness variation, thus supporting advanced communication standards like 5G.

Implementation Method 1

The integration of cavity filters within a glass core substrate using a laser-assisted etching process

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

the trench and the ridge lined with a conductive material; and a second core portion having a second surface, the second surface lined with the conductive material

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Data Source

PatentUS20240178162A1Integrated circuit packages including a glass core with a filter structure

Publication Date: 2024.05.30 INTEL CORP

AI summary

An integrated circuit (IC) package substrate including a glass core having a cavity filter structure, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include a core made of glass, and the core including a first core portion having a first surface and a trench and a ridge in the first surface, the trench and the ridge lined with a conductive material; and a second core portion having a second surface, the second surface lined with the conductive material, wherein the first surface of the first core portion is physically coupled to the second surface of the second core portion forming a cavity filter structure.