Glass Core Coupled Inductor Structure for Dense IC Power Delivery
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Solution Overview
Problem
Traditional IC packaging methods face challenges in efficiently delivering power to stacked IC chips, leading to increased current density and resistance due to the limited integration of voltage regulation circuitry, particularly when using glass substrates which are brittle and difficult to fabricate coupled inductor structures directly.
Innovation Solution
Integrate coupled coaxial metal inductor loop structures within a package substrate that includes a glass core, utilizing a magnetic material to magnetically couple plated through-holes, reducing physical space requirements and enhancing electrical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If IC chips are stacked on top of each other using 3D packaging techniques, then tighter integration is achieved, but current density and resistance increase
Solution Approach 1:
The patent transitions from planar (2D) side-by-side IC chip arrangement to three-dimensional (3D) stacked configuration, enabling tighter integration by utilizing the vertical dimension. Multiple IC chips are stacked on top of each other, increasing integration density while managing the associated current density and resistance challenges through this dimensional transition.
Solution Approach 2:
The patent segments the power delivery function by introducing separate power and ground traces that are interleaved in alternating fashion. This segmentation of electrical pathways into distinct power and ground segments reduces interference and manages current distribution in the stacked configuration, addressing the resistance issue while maintaining integration benefits.
2Use of energy by moving object
If voltage regulation circuitry is integrated into the substrate, then power delivery efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent merges the voltage regulation circuitry directly into the substrate structure, combining the power delivery function with the substrate itself. This integration of voltage regulation elements (inductors, capacitors, resistors) into the substrate creates a unified structure that improves power delivery efficiency by reducing parasitic inductance and resistance associated with separate discrete components.
Solution Approach 2:
The patent employs specific material parameters and geometric configurations to simplify fabrication. By using standard trace geometries, conventional materials, and established manufacturing processes for creating the voltage regulation elements, the patent achieves integrated power delivery while controlling fabrication complexity through careful parameter selection.
3Strength
If glass substrates are used, then rigidity and signal integrity improve, but ease of manufacture deteriorates
Solution Approach 1:
The patent performs preliminary actions by pre-forming the glass substrate with embedded trace patterns, via structures, and voltage regulation elements before final assembly. Through-glass vias are drilled and plated in advance, and metal traces are deposited on glass surfaces using established sputtering or evaporation techniques, making the manufacturing process more manageable despite glass's inherent fabrication challenges.
Solution Approach 2:
The patent uses composite material approaches by combining glass substrates with metal traces, dielectric layers, and conductive fillers. This composite structure leverages the rigidity and signal integrity benefits of glass while incorporating materials and structures that are compatible with standard semiconductor manufacturing processes, thereby improving ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient power distribution and reduced electrical resistance in IC packages by integrating coupled inductor structures within a glass core substrate, maintaining the rigidity benefits of glass while allowing for easier fabrication and improved manufacturing yield.
Implementation Method 1
utilizing a magnetic material to magnetically couple plated through-holes
Data Source
AI summary
An apparatus comprises a substrate comprising a glass core comprising a first surface, a second surface opposite the first surface, and a region away from peripheral edges of the glass core. The glass core includes a sidewall within the region between the first and second surfaces. A first dielectric material is over the first and second surfaces, along the sidewall, and within the region. The first dielectric material comprises a third surface and a fourth surface opposite the third surface. A magnetic material is between the third and fourth surfaces within the region. First and second plated holes extend through the magnetic material. A second dielectric material is between the first and second plated holes. The first and second plated holes, the magnetic material, and the second dielectric material may form a coupled inductor structure.