Pre-Singulation Glass Core Edge Features for Crack Control
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Solution Overview
Problem
Glass cores in microelectronic assemblies are susceptible to damage from mechanical and thermal stresses during the singulation process and subsequent thermal cycling, leading to crack formation and propagation that compromises the structural integrity of the glass.
Innovation Solution
Incorporating edge features such as continuous trenches, discontinuous openings, self-healing materials, anchors, daisy chain rings, and edge clamps into the glass cores before singulation to mitigate crack formation and propagation by dissipating stress and providing mechanical reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass cores are used to reduce package warpage and improve rigidity, then structural stability and thermal properties are improved, but the glass becomes highly susceptible to damage from mechanical and thermal stresses during singulation and thermal cycling
Solution Approach 1:
The patent applies preliminary action by forming stress-relief features (such as notches, grooves, or patterned structures) in the glass core before the singulation process. These pre-formed features are designed to concentrate and dissipate mechanical stresses during subsequent processing, preventing crack initiation and propagation while maintaining the glass core's rigidity and warpage resistance
Solution Approach 2:
The patent implements local quality by creating non-uniform stress distribution through localized structural modifications in the glass core. The stress-relief features are strategically positioned in specific regions to manage stress concentrations, allowing different parts of the glass core to have different mechanical properties - rigid in load-bearing areas and more compliant in stress-prone areas
2Productivity
If multiple IC dies are integrated in a single package to increase functionality and density, then device capacity is improved, but the complexity of managing different material properties increases, leading to package warpage
Solution Approach 1:
The patent applies parameter changes by modifying the mechanical and thermal parameters of the glass core through the incorporation of stress-relief features. These features alter the stress distribution parameters, allowing the glass core to accommodate thermal expansion differences between multiple IC dies and substrate materials, thereby reducing package warpage while maintaining the high-density multi-die integration
3Reliability
If glass cores are subjected to mechanical and thermal stresses during processing and operation, then functional performance is achieved, but crack formation and propagation occur, compromising structural integrity
Solution Approach 1:
The patent implements beforehand cushioning by incorporating stress-relief features that act as predetermined stress management mechanisms. These features are designed to absorb and dissipate mechanical and thermal stresses before they can propagate into critical cracks, providing a cushioning effect that protects the glass core's structural integrity while allowing necessary stress exposure for functional operation
Data Source
AI summary
Various techniques for alleviating crack formation and propagation in glass, and related devices and methods, are disclosed. The techniques are based on providing various edge features before singulation of a glass panel into individual glass units. In one aspect, an edge feature may be an opening in an edge region of a glass core, the opening extending from one of the faces of the glass core towards the opposite face of the glass core and comprising a fill material such as an insulator material, a polymer, or a conductive material. In another aspect, an edge feature may be an anchor comprising a first pad over one of the faces of a glass core, a second pad over the opposite face of the glass core, and a pin, wherein the pin is attached to the first pad and extends from the first pad into the glass core.