Layered Glass Core Substrate for Crack-Stopping Reliability
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Solution Overview
Problem
Current glass core substrates, composed of glass fiber and epoxy resin, fail to meet increasing reliability requirements due to rapid propagation of brittle cracks from the edge to the center of the substrate.
Innovation Solution
A glass core substrate design featuring three glass layers with bonding layers in between, where a conductive connector provides a vertical conductive path through the layers, acting as a crack-stopping structure to inhibit crack propagation, thereby enhancing the substrate's reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass fiber and epoxy resin materials are used for substrate composition, then manufacturing simplicity is maintained, but reliability is insufficient due to rapid crack propagation
Solution Approach 1:
The substrate is divided into multiple glass layers (first glass layer, second glass layer, third glass layer) separated by bonding layers. This segmentation creates intermediate bonding layers that act as crack-stopping structures, preventing rapid crack propagation through the entire substrate while maintaining overall structural integrity
Solution Approach 2:
The substrate employs a composite structure combining multiple glass layers with different properties and bonding layers (such as ABF material) in between. This composite design leverages the strengths of each material layer to achieve both high reliability through crack stopping and controlled electrical properties
2Reliability
If bonding layers are added between glass layers to stop cracks, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The bonding layers are pre-formed and positioned between glass layers before final substrate assembly. Conductive connectors are also preliminarily formed within the bonding layers, allowing crack-stopping functionality to be established before the substrate undergoes service stresses
Solution Approach 2:
Bonding layers serve as intermediary structures between glass layers, providing both mechanical bonding and crack-stopping functions. These intermediate layers include conductive connectors that facilitate electrical connection while the bonding layer material itself acts as a barrier to crack propagation
3Reliability
If conductive connectors are formed by removing portions of glass and bonding layers, then vertical conductive paths are achieved, but manufacturing precision requirements increase
Solution Approach 1:
The formation of conductive connectors is segmented into controlled removal of specific portions of glass layers and bonding layers. This segmentation allows for precise definition of connector geometry and position, ensuring accurate vertical conductive paths through the multi-layer structure
Solution Approach 2:
The manufacturing process utilizes parameter changes in material properties during removal and formation steps. By controlling removal parameters (depth, shape, position) and formation parameters (conductive material deposition, curing), precise conductive connectors are achieved with reliable electrical properties
Data Source
AI summary
A glass core substrate includes a first glass layer; a second glass layer disposed on the first glass layer; a third glass layer disposed on the second glass layer; a first bonding layer disposed between the first glass layer and the second glass layer; a second bonding layer disposed between the second glass layer and the third glass layer; and a conductive connector, passing through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer, wherein the conductive connector is configured to provide a vertical conductive path penetrating through the first glass layer, the first bonding layer, the second glass layer, the second bonding layer, and the third glass layer. A manufacturing method of a glass core substrate is also provided.