Glass-Core Packaging Substrate Curing for Alignment Stability
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Solution Overview
Problem
Existing packaging technologies for semiconductor devices, particularly those using ceramic or resin substrates, face challenges in alignment and positional stability of alignment marks, and are susceptible to shrinkage due to insulative material curing, which affects electrical performance and integration capabilities.
Innovation Solution
A method involving the use of a glass core with core vias and multiple metal and insulative material layers, where insulative material layers are pre-cured and post-cured at specific temperature ranges to minimize shrinkage, and alignment marks are maintained within a 5 μm difference, ensuring precise alignment and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulative material layers are cured at high temperature to ensure complete curing, then curing completeness is improved, but shrinkage deformation increases
Solution Approach 1:
The curing process is divided into multiple stages with different temperature ranges. The first curing stage uses a relatively low temperature (e.g., 80-150°C) to minimize shrinkage, while subsequent stages use progressively higher temperatures to ensure complete curing. This segmented approach resolves the contradiction by achieving both curing completeness and position stability through controlled temperature progression.
Solution Approach 2:
Before final high-temperature curing, preliminary curing is performed at lower temperatures to pre-set the insulative material layers and reduce subsequent shrinkage. This preliminary action prepares the material structure to withstand final curing with minimal deformation, thereby maintaining alignment mark position stability while ensuring complete curing.
2Reliability
If multiple insulative material layers are laminated to achieve desired insulation performance, then insulation capability is improved, but cumulative shrinkage deformation increases
Solution Approach 1:
Each insulative material layer is cured independently through controlled temperature stages before the next layer is added. This segmentation prevents cumulative shrinkage by ensuring each layer stabilizes at its proper position, maintaining alignment precision while achieving the desired number of insulation layers.
Solution Approach 2:
The curing temperature parameters are carefully controlled and adjusted for each layer lamination step. By optimizing temperature profiles for each specific layer, the patent minimizes shrinkage deformation while ensuring proper curing, thereby maintaining alignment accuracy across multiple layers.
3Stability of the object's composition
If glass core is used instead of ceramic or resin to reduce shrinkage, then shrinkage resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent uses a glass core as the base material for the packaging substrate. Glass provides inherent shrinkage resistance compared to traditional ceramic or resin substrates. This material selection resolves the contradiction by providing stable dimensional properties while the standardized manufacturing process keeps complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical performance and integration capabilities of semiconductor devices by improving alignment and reducing shrinkage-related deformations, enabling thinner and more integrated packaging substrates with improved signal transmission and reduced material fluidity.
Implementation Method 1
a 1-3rd operation of curing the first insulative material layer to prepare a first insulating layer
Implementation Method 2
capable of minimizing or preventing the influence of shrinkage of an insulative material
Data Source
AI summary
Disclosed is a method of manufacturing a substrate including a packaging substrate. The method includes an operation of preparing a glass core having core vias, a 1-1st operation of forming a first metal layer on the glass core, a 1-2nd operation of laminating a first insulative material layer on the first metal layer, a 1-3rd operation of curing the first insulative material layer to prepare a first insulating layer, a 2-1st operation of forming a second metal layer on the first insulative material layer so as to be electrically connected to the first metal layer, and a 2-2nd operation of laminating a second insulative material layer on the second metal layer. The 1-3rd operation includes pre-curing the first insulative material layer at a temperature of 80° C. or higher but lower than 175° C. and post-curing the first insulative material layer at a temperature of 175° C. to 230° C.