Glass-Core Packaging Substrate Curing to Minimize Warpage
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Solution Overview
Problem
The warpage phenomenon and separation of electronic elements in packaging substrates due to thermal expansion differences and stress are not adequately addressed in existing technologies, particularly when using glass cores and insulating films.
Innovation Solution
A method involving multiple curing steps for insulating films applied to glass cores, with varying pressures and temperatures, to form insulating layers on both surfaces, and incorporating electronic elements in cavity portions, thereby stabilizing the substrate structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single insulating film is applied and cured on the glass core, then the manufacturing process is simple, but warpage occurs due to thermal expansion differences
Solution Approach 1:
The insulating layer formation process is segmented into multiple steps: applying a first insulating film and curing it, then applying a second insulating film and curing it. This segmentation allows each layer to be optimized for specific functions - the first layer provides initial insulation and adhesion, while the second layer provides additional insulation and structural stability, collectively preventing warpage
Solution Approach 2:
The patent uses composite material structure by combining multiple insulating films with different properties on the glass core. The first insulating film and second insulating film have different thicknesses and curing characteristics, creating a composite insulating layer system that better matches the thermal expansion properties of the glass core and reduces warpage
2Reliability
If high pressure and temperature are applied during curing, then the insulating film cures completely, but electronic elements may separate from the cavity portion
Solution Approach 1:
The patent applies preliminary action by first applying and curing the first insulating film before applying the second insulating film. This sequential approach allows the first layer to establish a stable base that adheres to the glass core and cavity portions, preventing element separation while enabling complete curing of subsequent layers
Solution Approach 2:
The patent applies different curing conditions to different regions and layers. The first insulating film is cured under specific pressure and temperature conditions optimized for adhesion, while the second insulating film is cured under conditions optimized for complete curing. This local quality approach ensures both element adhesion and thorough curing without causing separation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes warpage and prevents element separation, ensuring a stable and defect-free packaging substrate with improved electrical performance and reduced manufacturing defects.
Implementation Method 1
a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film
Implementation Method 2
a pressure and a temperature applied during the secondary curing operation may be higher than a pressure and a temperature applied during the primary curing operation
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
The present disclosure relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The method of manufacturing a packaging substrate according to the present disclosure includes: an operation of generating a glass structure that is a core via, a cavity portion, or both on a glass core including a first surface and a second surface facing each other; an operation of forming an insulating layer on the first surface or second surface using an insulating film; and an operation of forming an upper layer including an upper distribution layer and an upper surface connection layer on the insulating layer. The operation of forming the insulating layer may include a primary curing operation of laminating a first insulating film on the first surface and primarily curing the first insulating film, and a secondary curing operation of laminating a second insulating film on the primarily cured first insulating film and secondarily curing the second insulating film. Accordingly, warpage may be improved, and separation of an electronic element may be prevented.