Glass Core Diffusion Layers for Low-Loss High-Strength Packaging
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Solution Overview
Problem
Existing glass core architectures lack the necessary low dielectric constants and mechanical modulus for high-speed IO applications and robust mechanical performance, and altering the bulk material to meet these requirements is cost-prohibitive.
Innovation Solution
A glass core with selectively implanted diffusion layers, such as borate or alumina, to locally adjust the dielectric constant and modulus, reducing the dielectric constant for low loss operations and increasing the modulus for mechanical reliability, using processes like ion implantation and heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional bulk glass materials are used, then manufacturing cost is reduced, but dielectric constant is too high for HSIO applications
Solution Approach 1:
The patent applies local quality by forming a diffusion layer with modified chemical composition (e.g., boron-phosphorus-oxygen) only at the via opening surfaces and interfaces where low dielectric constant is critical for HSIO performance, while the bulk glass core maintains its original cost-effective composition. This localized modification reduces signal loss in critical areas without requiring expensive bulk material changes throughout the entire glass core.
Solution Approach 2:
The patent creates a composite structure consisting of the base glass core material combined with a diffusion layer having different chemical composition and properties. The diffusion layer, formed by introducing species such as boron and phosphorus into the glass surface, creates a composite material system where the interface region has optimized dielectric properties for low loss while the bulk material maintains mechanical strength and cost-effectiveness.
2Strength
If bulk glass material is altered to provide robust mechanical performance, then mechanical strength is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent applies local quality by concentrating mechanical reinforcement through diffusion layer formation only at critical stress regions, specifically at the via opening surfaces and interfaces where stress concentration occurs during packaging processes. The diffusion layer with modified composition (e.g., higher boron-phosphorus content) provides localized strength enhancement without requiring expensive bulk material changes throughout the entire glass core structure.
3Reliability
If ion implantation and heat treatment are applied to form diffusion layers, then electrical and mechanical properties are optimized, but process complexity increases
Solution Approach 1:
The patent merges multiple functions into a single diffusion layer formation process. The ion implantation introduces species (boron, phosphorus) that simultaneously achieve both electrical optimization (lower dielectric constant for HSIO) and mechanical reinforcement (enhanced strength at via interfaces). The subsequent heat treatment process then performs dual roles of activating the diffusion and stabilizing the glass structure, reducing the need for separate processing steps and simplifying the overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables low loss and high strength applications without the need for bulk material changes, optimizing electrical and mechanical properties where needed while maintaining cost-effectiveness.
Implementation Method 1
a diffusion layer along the first surface, the second surface, and the via opening
Implementation Method 2
using processes like ion implantation and heat treatment
Implementation Method 3
using processes like ion implantation and heat treatment
Data Source
AI summary
Embodiments disclosed herein include glass cores and methods of forming glass cores. In an embodiment, a core for an electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass, In an embodiment, a via opening is provided through the substrate, and a diffusion layer is along the first surface, the second surface, and the via opening.