Glass-Core Packaging Substrate With Dual-Dk Cavity Insulation
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Solution Overview
Problem
The existing packaging substrates face challenges with undulation phenomena due to gaps between electronic elements and/or between the cavity portion and the electronic element, which can lead to leakage current and defects in the packaging substrate.
Innovation Solution
A packaging substrate is designed with a glass core and a cavity portion that includes a cavity module with electronic elements, a first insulating layer, and a third insulating layer. The first insulating layer has a lower dielectric constant than the third insulating layer, and both layers are arranged to prevent short circuits and undulation phenomena.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cavity portion is formed in a glass substrate to mount electronic elements, then the electrical performance and heat dissipation are improved, but undulation phenomena occur due to gaps between electronic elements and/or between the cavity portion and the electronic element
Solution Approach 1:
The patent applies different insulating materials with different dielectric constants to different locations within the cavity portion. Specifically, a first insulating material is applied to the bottom surface of the cavity portion, while a second insulating material is applied to the side surfaces. This local differentiation allows the bottom surface to provide stable support (reducing undulation) while the side surfaces provide insulation and gap filling, thus resolving the undulation issue without compromising electrical performance
Solution Approach 2:
The patent uses composite insulating structures combining multiple materials with different dielectric constants (Dk1 for the first insulating layer, Dk3 for the third insulating layer, where Dk1 < Dk3). This composite approach allows optimization of both mechanical support (using lower Dk material at bottom) and electrical insulation (using higher Dk material at sides), preventing undulation while maintaining reliable electrical connections
2Ease of manufacture
If gaps exist between electronic elements and/or between the cavity portion and the electronic element, then the mounting process is simplified, but leakage current occurs and undulation phenomena are generated
Solution Approach 1:
The patent introduces insulating materials as intermediary substances that fill the gaps between electronic elements and the cavity portion. The first insulating material at the bottom and the second insulating material at the sides act as mediators that eliminate direct conductive paths through gaps, thereby preventing leakage current while maintaining the simplified mounting process
Solution Approach 2:
Different insulating materials are strategically placed in different locations to address specific issues: the first insulating material at the bottom surface prevents leakage current and provides mechanical support, while the second insulating material on the side surfaces provides additional insulation and gap filling. This localized approach prevents leakage current without complicating the overall mounting process
Data Source
Figure 1
Figure 2A~2B
Figure 3A(a)~3A(b)
AI summary
The present disclosure relates to a packaging substrate and a method for manufacturing a packaging substrate. The packaging substrate according to the present disclosure includes a core layer comprising a glass core having first and second surfaces opposite each other and a cavity portion penetrating the glass core; a cavity module and a second insulating layer disposed in the cavity portion. The cavity module comprises: a plurality of electronic elements, a first insulating layer and a third insulating layer. The first insulating layer covers each of the electronic elements with a coating material. The first insulating layer is disposed on an entire surface or an entire surface except one surface of each of the electronic elements. The third insulating layer disposes to cover the electronic elements with a molding material. The second insulating layer is embedded in a portion of the cavity portion excluding the cavity module. The first insulating layer and the third insulating layer have different dielectric constants. This prevents the occurrence of an undulation phenomenon due to a gap between the elements and/or a gap between the cavity module and the elements and prevents the occurrence of a leakage current.