Glass-Core Package Interconnects for Low-Loss Edge Plugging
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Solution Overview
Problem
Integrated circuit packages face challenges in reducing size and increasing interconnect density while maintaining mechanical strength and signal integrity, particularly due to limitations in second-level interconnects which can lead to increased complexity and insertion loss.
Innovation Solution
The use of a glass core in the package substrate with pluggable interconnects that protrude beyond the package edges, allowing for off-package communications without routing through the entire substrate, thereby reducing the need for internal interconnects and enabling more efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If second-level interconnects are used to connect IC chips to circuit boards, then electrical connection is achieved, but package size increases and signal integrity deteriorates due to insertion loss and crosstalk
Solution Approach 1:
The patent extracts the interconnect function from the traditional second-level substrate path and relocates it to the package substrate edge. Pluggable interconnects protrude from the package substrate perimeter, enabling direct connection to circuit boards without routing signals through the entire substrate. This extraction eliminates insertion loss and crosstalk while reducing package size.
Solution Approach 2:
The patent transitions from planar interconnect routing (2D) to three-dimensional protruding interconnects extending from the package edge. This dimensional change allows signals to connect directly to the circuit board without traversing the substrate plane, thereby improving signal integrity and reducing the required package area.
2Volume of moving object
If interconnect density is increased to reduce package size, then more connections are achieved, but mechanical strength and signal integrity are compromised
Solution Approach 1:
The patent segments the interconnect function into multiple protruding elements distributed along the package substrate edge. This segmentation allows high interconnect density without concentrating stress in a single location, thereby maintaining mechanical strength while achieving compact packaging.
3Reliability
If traditional routing through the entire substrate is used, then signal transmission is achieved, but insertion loss and crosstalk increase
Solution Approach 1:
The patent extracts the signal transmission path from the traditional through-substrate route and creates a direct connection path via protruding interconnects at the package edge. This extraction eliminates the harmful effects of insertion loss and crosstalk that occur when signals traverse the entire substrate.
Data Source
AI summary
Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die and a substrate including a glass core. The apparatus also includes a pluggable interconnect including a portion of the glass core. The pluggable interconnect includes a transmission line extending along the portion of the glass core.