Glass-Core Substrate Edge Passivation for Crack-Free Dicing

Solution Overview

Problem

The challenges in semiconductor manufacturing include material failures, precision and scaling requirements, power delivery, limited failure tolerance, and high manufacturing costs, particularly exacerbated by warpage and shrinkage issues in glass-cored substrates due to CTE mismatches during the debonding of rigid carriers, leading to cracks and defects.

Innovation Solution

A singulation system utilizing laser ablation, filamentation, and edge passivation techniques to modify and encapsulate glass-cored semiconductor package substrates, including polymer ablation, tape lamination, and edge grinding to mitigate stress and defects, followed by edge passivation with UV-curable or heat-curable polymers to enhance structural integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If glass-cored substrates are used for rigid carrier debonding, then low total thickness variation is achieved, but warpage and cracking occur due to CTE mismatches

Engineering Contradiction:

Improvetotal thickness variationVSAvoidsubstrate integrity

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by performing stress relief processing (such as annealing or controlled heating) on the glass-cored substrate before the debonding operation. This pre-treatment reduces the internal stresses accumulated during manufacturing and prevents cracking that would occur during the subsequent debonding process, thereby maintaining both thickness precision and substrate integrity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes physical parameters of the glass-cored substrate, specifically controlling the thermal history and stress state through controlled heating or annealing processes. By adjusting these parameters before debonding, the substrate's resistance to warpage and cracking is improved while maintaining the low TTV characteristic of glass cores

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If laser ablation is used for singulation, then precise cutting is achieved, but edge stress and micro-cracks are generated

Engineering Contradiction:

Improvesingulation precisionVSAvoidedge stress and micro-cracks

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing stress relief processing (such as annealing or controlled heating) on the glass-cored substrate before the debonding operation. This pre-treatment reduces the internal stresses accumulated during manufacturing and prevents cracking that would occur during the subsequent debonding process, thereby maintaining both thickness precision and substrate integrity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes physical parameters of the glass-cored substrate, specifically controlling the thermal history and stress state through controlled heating or annealing processes. By adjusting these parameters before debonding, the substrate's resistance to warpage and cracking is improved while maintaining the low TTV characteristic of glass cores

Inventive Principle:

Principle #35Parameter changes

3Reliability

If thinned chips are used for chip stacking, then device performance is improved, but handling and manufacturing become more difficult

Engineering Contradiction:

Improvedevice performanceVSAvoidhandling difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent introduces a temporary rigid glass substrate as an intermediary carrier that provides mechanical support during manufacturing and handling operations. This mediator enables precise positioning and stable handling of thinned chips without requiring complex handling equipment, while being removable after the stacking process is complete

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively reduces warpage and cracking, ensuring precise singulation and edge protection, thereby improving the reliability and efficiency of semiconductor package substrates by maintaining low total thickness variation and reducing material defects.

Implementation Method 1

A singulation system utilizing laser ablation, filamentation, and edge passivation techniques to modify and encapsulate glass-cored semiconductor package substrates, including polymer ablation

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

altering occurs in exposed regions between package substrates and wherein altering occurs through exposure to a laser beam

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 3

edge passivation with UV-curable or heat-curable polymers

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 4

edge passivation with UV-curable or heat-curable polymers

Methodology Applied

Scientific EffectHeat curing: Heat Treatment

Data Source

PatentUS20250210586A1Semiconductor package substrate dicing and edge passivation

Publication Date: 2025.06.26 INTEL CORP

AI summary

Processes and process equipment for modifying edges of semiconductor package substrates, and semiconductor package substrates having modified edges are provided. The processes and process equipment are especially useful for semiconductor package substrates that have cores that can crack or chip during processing, such as, for example, cores comprised of glass. Semiconductor package substrates having glass cores and modified edges are also provided.