Glass Core Packaging Substrate for Fine-Pitch Signal Routing
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Solution Overview
Problem
Existing semiconductor packaging technologies do not adequately support high-performance and high-frequency semiconductor elements due to limitations in pitch reduction, electrical resistance, and dielectric permittivity, leading to issues such as short circuits and inefficient signal transmission.
Innovation Solution
A packaging substrate using a glass core with a cavity portion and dimples, surrounded by a molding material, which includes an insulating layer and protrusions to maintain element spacing and prevent short circuits during the molding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin substrate is used for packaging, then high-performance and high-frequency semiconductor elements can be mounted, but there is a limitation in pitch reduction of lines
Solution Approach 1:
The patent uses a glass substrate instead of traditional resin substrates. Glass provides both the necessary electrical performance for high-frequency elements and allows for greater pitch reduction. The glass substrate serves as a composite solution combining mechanical support with electrical pathway functionality, enabling finer line pitches while maintaining signal integrity.
Solution Approach 2:
The patent introduces through-holes penetrating the glass substrate to create vertical electrical pathways. This dimensional approach (adding Z-axis connectivity) allows signal transmission through the substrate thickness, enabling compact routing and finer pitch in the planar dimensions without compromising electrical performance.
2Stability of the object's composition
If a ceramic substrate is used for packaging, then structural stability is achieved, but it is difficult to mount high-performance and high-frequency semiconductor elements due to high resistance value or high dielectric permittivity
Solution Approach 1:
The patent employs a glass substrate that combines the structural stability characteristic of ceramics with the electrical performance advantages of glass. The glass material provides low dielectric permittivity and low resistance, enabling high-frequency signal transmission while maintaining mechanical stability and support for semiconductor elements.
Solution Approach 2:
The patent changes the material parameter from ceramic to glass, which fundamentally alters the dielectric properties. Glass has lower dielectric permittivity and resistance compared to ceramic, enabling high-performance electrical connections while maintaining sufficient structural stability for packaging applications.
3Productivity
If elements are placed closer together to reduce pitch, then packaging density is improved, but short circuits may occur between adjacent elements
Solution Approach 1:
The patent uses an insulating layer as an intermediary material between adjacent conductive elements. This insulating layer physically separates the elements while allowing them to be placed at reduced pitch, preventing direct electrical contact and short circuits. The insulator acts as a mediator that enables closer spacing without compromising electrical isolation.
Solution Approach 2:
The patent utilizes the glass substrate's inherent properties to provide both structural support and electrical isolation. The glass material's uniform composition and controlled porosity allow for precise insulation between elements at reduced pitch, enabling high packaging density while maintaining reliable electrical separation.
Data Source
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AI summary
The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer comprising a glass core and a cavity portion, wherein the glass core is a glass substrate having a first surface and a second surface facing each other, the cavity portion has an accommodation space for accommodating an electronic element as a part of the glass core is recessed or penetrated, and the element package is placed in the accommodation space of the cavity portion, wherein the element package comprises i) a plurality of arranged electronic elements; and ii) a molding portion containing a molding material and the molding portion arranges for the molding material to surround the electronic elements, and a concave portion having arranged dimples is disposed in some of the molding portion at the element package.