Glass Core Panel Frames With CTE Matching to Prevent Warpage
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Solution Overview
Problem
The introduction of a glass layer in semiconductor package architectures leads to warpage and separation issues due to temperature and mechanical stresses, which reduces yield and compatibility with existing organic substrate components.
Innovation Solution
The use of frames made from materials like Kovar®, Invar®, and Stainless Steel® with controlled coefficient of thermal expansion (CTE) to embed glass cores, reducing warpage and enabling handling on existing organic substrate manufacturing infrastructure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a glass layer is introduced to improve dimensional stability, then the ability to place more die on a single substrate package is improved, but warpage and separation issues occur due to temperature and mechanical stresses
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the coefficient of thermal expansion (CTE) of the frame material to match that of the glass core. This parameter matching prevents differential thermal expansion during manufacturing and operation, thereby eliminating warpage and separation issues while preserving the dimensional stability benefits of the glass layer.
Solution Approach 2:
The patent employs composite materials by creating a hybrid structure that combines the glass core with a specifically engineered frame material. This composite approach leverages the dimensional stability of glass while compensating for its brittleness and thermal expansion characteristics through the frame, resulting in a reliable hybrid component that avoids warpage and separation.
2Stability of the object's composition
If a glass layer is introduced to improve dimensional stability, then the ability to place more die on a single substrate package is improved, but separation issues occur between the glass core and surrounding materials
Solution Approach 1:
The patent addresses bonding strength by matching the CTE parameter of the frame material to that of the glass core. This parameter alignment ensures that both materials expand and contract at the same rate during thermal cycling, preventing stress accumulation that would otherwise cause separation at the interface between the glass core and surrounding materials.
Solution Approach 2:
The patent directly applies thermal expansion principles by selecting frame materials with CTE values specifically matched to the glass core. This thermal expansion matching prevents differential movement between the glass core and frame during temperature changes, thereby maintaining strong bonding and preventing separation issues while preserving the dimensional stability advantages of the glass layer.
3Ease of manufacture
If frames are made with higher CTE materials, then handling and manufacturing are easier, but warpage occurs under temperature and mechanical stresses
Solution Approach 1:
The patent resolves the contradiction between ease of manufacture and warpage prevention by changing the CTE parameter of the frame material to match that of the glass core. This parameter selection enables the frame to accommodate the glass core during thermal and mechanical processing without undergoing differential expansion that would cause warpage, while still providing sufficient structural support for handling and manufacturing operations.
Solution Approach 2:
The patent applies thermal expansion principles by selecting frame materials whose CTE matches the glass core. This thermal expansion compatibility allows the assembly to undergo uniform dimensional changes during manufacturing and operation, preventing warpage while maintaining the structural integrity needed for easy handling and processing.
4Volume of moving object
If the glass core layer is made thinner to reduce size, then the component size is reduced, but the glass core becomes more delicate and subject to warpage
Solution Approach 1:
The patent addresses the warpage resistance of thin glass cores by changing the CTE parameter of the frame material to match the glass. This parameter matching creates a thermally compatible interface that supports even thin glass cores during thermal and mechanical processing, preventing warpage while allowing the component size to be reduced through thinner glass layer implementation.
Solution Approach 2:
The patent applies thermal expansion principles by ensuring the frame material has a CTE matched to the thin glass core. This thermal expansion compatibility provides uniform dimensional stability during temperature changes, enabling the use of thinner glass layers for size reduction without compromising warpage resistance, as the frame compensates for the reduced structural rigidity of thinner glass.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively controls warpage and separation issues, allowing glass core hybrid components to be reconstituted into panels or wafers for efficient manufacturing and integration with existing tools.
Implementation Method 1
The use of frames made from materials like Kovar®, Invar®, and Stainless Steel® with controlled coefficient of thermal expansion (CTE) to embed glass cores, reducing warpage
Data Source
AI summary
Architectures and process flows for frames for glass core hybrid panels for semiconductor packaging. The glass core includes a layer of glass defined by a planar area enclosed by one or more edges that are substantially orthogonal to the planar area and at least one through-glass via (TGV) in the layer of glass, substantially filled with a conductive material. The frame comprises a coefficient of thermal expansion (CTE) that can be manipulated based on selection of frame material and/or percentage of copper in the frame material. The frame has a CTE of less than 11. The frame can enclose a panel, sub-panel or wafer and can include one or more cavities therein for respective glass cores.