Glass-Core Packaging Substrate With Half-Cavity Bonding Strength
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently mounting high-performance, high-frequency semiconductor elements due to limitations in reducing wiring pitch and thermal expansion coefficient mismatches, which affect electrical performance and heat dissipation.
Innovation Solution
A packaging substrate with a glass core layer featuring a cavity portion and core vias, where the glass core is composed of laminated first and second glasses bonded without a polymeric adhesive layer, and the core vias have a minimum inner diameter region, facilitating shorter electrical paths and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If resin substrates are used for packaging, then it is possible to mount relatively high performance, high frequency semiconductor elements, but there are limitations in reducing the pitch of the wiring
Solution Approach 1:
The patent changes the material parameter from resin to glass for the substrate, which fundamentally alters the electrical properties and enables smaller wiring pitch while maintaining high-frequency signal transmission capability. The glass material provides better electrical characteristics that allow for reduced wiring pitch without sacrificing signal speed.
2Speed
If through holes are formed in silicon or glass substrate and conductive materials are applied, then the wiring between the element and the motherboard can be shortened and have good electrical characteristics, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the substrate material selection with the via formation approach by using glass substrate that can be directly processed with through-hole technology. This combination eliminates the need for separate complex interconnection structures, as the glass substrate inherently supports both the mechanical support and electrical interconnection functions through its through-holes.
3Reliability
If ceramic substrates are used, then high resistivity or high dielectric constant is achieved, but it is difficult to mount high performance, high frequency semiconductor elements
Solution Approach 1:
The patent changes the dielectric material from ceramic to glass, which modifies the electrical parameters to achieve an optimal balance. The glass material provides lower dielectric constant compared to ceramic, enabling faster signal transmission while maintaining sufficient electrical stability for reliable mounting of high-frequency semiconductor elements.
4Strength
If the glass core includes laminated first and second glass without polymeric adhesive layer, then bonding strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent extracts and eliminates the polymeric adhesive layer from the lamination structure, creating a direct glass-to-glass bond. This removal of the intermediate adhesive layer simplifies the structure and improves bonding strength through direct fusion, while the manufacturing precision is managed through controlled bonding processes that ensure proper alignment and bonding conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances electrical performance by reducing wiring pitch and improving signal transmission speed, while also addressing thermal management issues through efficient heat dissipation, thus overcoming limitations in existing semiconductor packaging technologies.
Implementation Method 1
the first glass and the second glass may be bonded to each other in an anodic bonding state
Data Source
AI summary
The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure may comprise a core layer comprising a glass core having a first surface and a second surface facing each other, a cavity portion opening recessed in the direction of the first surface or the second surface, and a plurality of core vias penetrating the glass core in the thickness direction, wherein the internal space of the cavity includes a first section recessed space within glasses at regular depths in the thickness direction and a second section recessed space within at increasingly smaller widths in the thickness direction. Through it, the effect of strengthening the bonding force of the glasses forming the glass core with the half-cavity can be achieved to prevent delamination of the glasses forming the glass core even after multiple high-temperature processes.