Glass Core Packaging Substrate With Half-Cavity Delamination Resistance
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently mounting high-performance, high-frequency semiconductor elements due to limitations in reducing wiring pitch and issues with heat dissipation.
Innovation Solution
A packaging substrate with a glass core layer featuring a cavity portion and core vias that penetrate the glass core in a thickness direction, allowing for shorter electrical flow lengths and improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If resin substrates are used for packaging, then it is possible to mount relatively high performance, high frequency semiconductor elements, but there are limitations in reducing the pitch of the wiring
Solution Approach 1:
The patent changes the material parameter from resin to glass for the substrate, which fundamentally alters the electrical characteristics and enables both higher frequency performance and smaller wiring pitch reduction, resolving the limitation of resin substrates
Solution Approach 2:
The patent employs a composite structure combining glass substrate with metal through-holes and conductive materials, creating a hybrid system that leverages the advantages of different materials to achieve both high frequency performance and reduced wiring pitch
2Length of moving object
If through holes are formed in silicon or glass substrate and conductive materials are applied, then the wiring between the element and the motherboard can be shortened and have good electrical characteristics, but the device complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming through-holes and pre-applying conductive materials to the substrate before final assembly, which simplifies the overall manufacturing process despite the added steps, as these preparations enable the wiring shortening benefit
3Power
If the packaging substrate generates heat during operation, then the semiconductor package can function, but heat dissipation becomes a challenge
Solution Approach 1:
The patent extracts heat from the packaging substrate by introducing through-holes that serve as thermal pathways, removing heat from the core operational area and transporting it to external dissipation points, thereby solving the heat accumulation problem while maintaining operational power
Data Source
Figure 1~2
Figure 3A~3B
Figure 4A~4C
AI summary
The present disclosure relates to a manufacturing method for a packaging substrate and a packaging substrate utilizing the method. The packaging substrate according to the present disclosure may comprise a core layer comprising a glass core having a first surface and a second surface facing each other, a cavity portion opening recessed in the direction of the first surface or the second surface, and a plurality of core vias penetrating the glass core in the thickness direction, wherein the internal space of the cavity includes a first section recessed space within glasses at regular depths in the thickness direction and a second section recessed space within at increasingly smaller widths in the thickness direction. Through it, the effect of strengthening the bonding force of the glasses forming the glass core with the half-cavity can be achieved to prevent delamination of the glasses forming the glass core even after multiple high-temperature processes.