Glass-Core Integrated Inductor Layout for High-Density Fabrication
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Solution Overview
Problem
Existing inductor architectures in electronic packages are limited by low permeability magnetic materials, requiring frequent drill bit replacements, high production costs, and reduced throughput due to mechanical drilling, which impedes the scaling of inductors to smaller dimensions and pitches.
Innovation Solution
The use of laser-assisted etching processes to fabricate inductors in glass cores, allowing for high permeability materials and avoiding mechanical drilling, enabling the parallel fabrication of multiple inductors with reduced distances between metallized holes and magnetic material holes, thereby increasing inductor density and reducing production time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical drilling is used to create via openings in cured magnetic material, then via openings can be formed, but drill bits need frequent replacement which increases costs and reduces throughput
Solution Approach 1:
The patent replaces mechanical drilling with laser drilling to create via openings in the magnetic material. This substitution eliminates the need for frequent drill bit replacement while maintaining manufacturing capability, directly addressing both the ease of manufacture and productivity concerns by using a non-contact laser process that does not suffer from mechanical wear.
Solution Approach 2:
The patent changes the drilling method from mechanical to laser-based, fundamentally altering the process parameters. This parameter change allows for continuous operation without tool replacement, improving throughput while maintaining ease of manufacture through a more reliable process.
2Manufacturing precision
If each inductor is drilled separately with mechanical drilling, then individual via openings are created, but it takes a long time to make all via openings for an electronic package
Solution Approach 1:
The patent replaces mechanical drilling with laser drilling, enabling faster processing. The laser method can create multiple via openings more rapidly and can potentially process multiple inductors in parallel, significantly reducing production time while maintaining the precision needed for individual via openings.
Solution Approach 2:
The patent employs laser drilling which can pre-process multiple via openings in a more efficient manner compared to sequential mechanical drilling. This preliminary action reduces the overall time required to create all necessary via openings across multiple inductors.
3Reliability
If paste printed and cured magnetic material is used, then inductors can be formed, but the cured material is very hard requiring frequent drill bit replacement
Solution Approach 1:
The patent replaces mechanical drilling with laser drilling to process the hard cured magnetic material. This substitution maintains the reliability benefits of the paste-printed magnetic material while eliminating the manufacturing difficulties associated with its hardness, as laser drilling is not affected by material hardness in the same way mechanical drilling is.
Solution Approach 2:
The patent replaces mechanical drilling with laser drilling to process the hard cured magnetic material. This substitution maintains the reliability benefits of the paste-printed magnetic material while eliminating the manufacturing difficulties associated with its hardness, as laser drilling is not affected by material hardness in the same way mechanical drilling is.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables inductors with higher inductivities and improved density, allowing up to 10× more inductors per unit area, while reducing manufacturing time and costs, and facilitating the integration of wideband regulators using coupled buck topologies.
Implementation Method 1
laser-assisted etching processes to fabricate inductors in glass cores
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a magnetic ring is embedded in the substrate. In an embodiment, a loop is around the magnetic ring. In an embodiment, the loop is conductive and comprises a first via through the substrate, a second via through the substrate, and a trace over a surface of the substrate, where the trace electrically couples the first via to the second via.


