Glass Core Insulator Tapering for Stress-Resistant IC Packages
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Solution Overview
Problem
Glass cores in IC packages are susceptible to damage due to mechanical and thermal stresses, particularly from through-glass vias filled with metals, leading to potential cracks and degradation due to mismatched coefficients of thermal expansion.
Innovation Solution
Fabricating glass cores with tapered insulator edges to reduce stress concentrations by minimizing insulator material at the edges, achieved through methods like laser ablation or photo-lithography using greyscale masks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass cores are used in IC packages, then rigidity and thermal properties are improved, but susceptibility to mechanical and thermal stress damage increases
Solution Approach 1:
The insulator material is applied with varying thickness across the glass core surface - thinner at edges and thicker at centers. This local variation in material distribution reduces stress concentrations at vulnerable edge regions while maintaining electrical insulation performance across the entire structure.
Solution Approach 2:
The insulator material thickness parameter is deliberately changed as a function of position on the glass core. By making the insulator layer non-uniform (thinner at edges, thicker at centers), the structural and stress properties are optimized for different regions, reducing overall susceptibility to stress damage.
2Reliability
If through-glass vias filled with metals are used, then electrical connectivity is improved, but stress-induced cracking increases
Solution Approach 1:
The insulator material provides localized stress relief around metal-filled vias, particularly at edge regions where stress concentrations are highest. This local protective quality prevents crack propagation while maintaining the electrical connectivity function of the metal vias.
3Adaptability or versatility
If multiple IC dies are integrated in a single package, then functionality and density are improved, but package warpage increases
Solution Approach 1:
The non-uniform insulator thickness creates regions of differentiated mechanical properties within the package structure. The thicker central regions provide structural support while thinner edge regions accommodate thermal expansion differences, collectively reducing package warpage.
Solution Approach 2:
The package structure combines glass core material with insulator material in a composite configuration. This multi-material approach allows optimization of different regions for different functions - electrical insulation, stress management, and warpage control - enabling stable integration of multiple IC dies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces stress on glass cores, enhancing structural integrity and enabling reliable integration of multiple materials within a single IC package with reduced warpage and increased design flexibility.
Implementation Method 1
achieving through methods like laser ablation or photo-lithography using greyscale masks
Implementation Method 2
achieving through methods like laser ablation or photo-lithography using greyscale masks
Data Source
AI summary
Microelectronic assemblies with glass cores with tapered insulator edges, as well as related devices and fabrication techniques, are disclosed. In one aspect, a microelectronic assembly according to an embodiment of the present disclosure may include a glass core (e.g., a layer of glass or a glass structure) having a first face, and an insulator material having a bottom face, a top face opposite the bottom face, and an outer edge extending between the bottom face and the top face. The top bottom face of the insulator material is on the glass core, and the outer edge of the insulator material tapers from a first perimeter at the bottom face to a second perimeter at the top face. The taper of the outer edge results in the first perimeter being larger than the second perimeter.