Glass Core IC Packages Embedding MEMS Dies
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Solution Overview
Problem
Current integrated circuit (IC) packages face challenges in controlling warpage and achieving high interconnect density as technology advances, which affects device reliability and electrical performance, particularly with increasing package size and the need for greater functionality.
Innovation Solution
The use of a glass core in IC packages to embed micro electromechanical system (MEMS) dies, providing mechanical strength, reducing substrate warpage, and enabling higher density electrical routing, thereby enhancing the electrical performance of the IC package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional organic cores are used in IC packages, then ease of manufacture is maintained, but substrate warpage increases and mechanical strength decreases
Solution Approach 1:
The patent employs a glass core as a composite material alternative to traditional organic cores. The glass core provides superior mechanical strength and warpage control while maintaining compatibility with standard IC packaging manufacturing processes, thus resolving the contradiction between mechanical strength and ease of manufacture.
2Adaptability or versatility
If package size increases to accommodate greater functionality, then device functionality improves, but substrate warpage increases and reliability decreases
Solution Approach 1:
The glass core acts as a stable substrate that maintains dimensional stability and reduces warpage even as package size increases. This allows the IC package to accommodate greater functionality through larger size without compromising reliability, as the glass core provides the mechanical stability needed to prevent warpage-related failures.
3Reliability
If interconnect density is increased to improve electrical performance, then electrical performance improves, but manufacturing complexity increases
Solution Approach 1:
The glass core enables localized optimization of interconnect structures. Its stable surface and controlled thermal expansion properties allow for precise placement and routing of interconnects at high density without introducing additional manufacturing complexity, as the glass substrate itself does not add processing steps.
Data Source
AI summary
MEMS dies embedded in glass cores of integrated circuit (IC) package substrates are disclosed. An example integrated circuit (IC) package includes a package substrate including a glass core, the example integrated circuit (IC) package also includes a micro electromechanical system (MEMS) die positioned in a cavity of the glass core.