Glass Core Microfluidic Channels for Package Heat Dissipation
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Solution Overview
Problem
The susceptibility of electronic package substrates to warping due to increased internal stress limits the size and reliability of multi-die assemblies, and the use of glass cores for stiffening reduces thermal conductivity, posing challenges in heat management.
Innovation Solution
Incorporating channels within a glass core layer in the electronic package substrate to carry electrically non-conductive liquid coolant for heat removal, combined with through glass vias for electrical continuity and redistribution layers for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If glass core material is used to reduce warping, then structural stability is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses glass core material combined with embedded micro-fluidic channels to create a composite structure that maintains the structural stability of glass while adding thermal management capabilities through the fluid circulation system
Solution Approach 2:
The patent introduces a fluid medium as an intermediary to transfer heat away from the electronic components, using the micro-fluidic channels to circulate coolant that absorbs and removes heat generated by high-power ICs
2Adaptability or versatility
If multiple IC dies are integrated into a single package, then system functionality is improved, but area form factor increases
Solution Approach 1:
The patent merges multiple IC dies and interconnect structures into a single integrated package substrate, combining multiple functional components into one unified structure to achieve system functionality while controlling package size
Solution Approach 2:
The patent transitions from two-dimensional planar integration to three-dimensional vertical stacking by forming trenches and filling them with conductive material to create vias that connect different layers of IC dies, enabling vertical interconnections that reduce the horizontal area footprint
3Adaptability or versatility
If package area form factor increases, then system functionality is improved, but warping susceptibility increases
Solution Approach 1:
The patent employs a composite structure with glass core material that provides inherent warping resistance, combining the stiffness of glass with the thermal management capabilities of embedded fluid channels to maintain structural stability in larger packages
Solution Approach 2:
The patent segments the package substrate into multiple functional layers including glass core layers, organic core layers, and embedded micro-fluidic channel systems, allowing each layer to perform its specific function while contributing to overall structural stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management by providing a path for heat extraction, improving the reliability and size constraints of electronic packages while maintaining structural integrity and electrical connectivity.
Implementation Method 1
In-situ micro-fluidic channels for heat dissipation in glass substrate... Incorporating channels within a glass core layer in the electronic package substrate to carry electrically non-conductive liquid coolant for heat removal
Data Source
AI summary
An electronic device and associated methods are disclosed. In one example, the electronic device includes a glass core layer having a first surface layer and a second surface layer; multiple channels within the glass core layer between the first surface and the second surface layer; and a first redistribution layer (RDL) including multiple sublayers of conductive traces formed in an organic material, wherein a first surface of the RDL contacts the first surface of the glass core layer.